Three-dimensional modeling of mold filling in microelectronics encapsulation process

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 1, 2004, Pages 200-209

  Chang, Rong Yeon ^a   Yang, Wen Hsien ^b   Hwang, Sheng Jye ^c   Su, Francis ^d  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b the author moved institutions and now has the following affiliation   (Taiwan)

^c NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^d ChipMOS TECHNOLOGIES Bermuda LTD   (Taiwan)

Author keywords

Finite volume method; IC packaging; Three dimensional; Transfer molding; VOF

Indexed keywords

ENCAPSULATION; FILLING; FINITE VOLUME METHOD; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; PLASTICS MOLDING; THREE DIMENSIONAL; TRANSFER MOLDING; TWO PHASE FLOW;

MICROELECTRONICS ENCAPSULATION PROCESS; MOLD FILLING;

MICROELECTRONIC PROCESSING;

EID: 2442484470     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.821682     Document Type: Article

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