Rheological characterization and full 3D mold flow simulation in multi-die stack CSP of chip array packaging

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1029-1037

  Lee, Min Woo ^a   Khim, Jin Young ^a   Yoo, Min ^a   Chung, JiYoung ^a   Lee, Choon Heung ^a  

^a Amkor Technology Korea Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; COMPUTER SIMULATION; MICROPROCESSOR CHIPS; MOLDS; RHEOLOGY; SHEAR STRESS;

CHIP ARRAY PACKAGING; MOLD FLOW; RHEOKINETIC SIMULATION; STACKING STRUCTURE;

ELECTRONICS PACKAGING;

EID: 33845575695     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645780     Document Type: Conference Paper

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