Flow modeling and visualization of the transfer molding of plastic ball grid array packages

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 177-184

  Nguyen, L T ^a   Quentin, C G ^a   Lee, W W ^a  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER SIMULATION; COMPUTER SOFTWARE; COST EFFECTIVENESS; ENCAPSULATION; GRAPHICAL USER INTERFACES; TRANSFER MOLDING; VIDEO CAMERAS;

FLOW MODELING; PLASTIC BALL GRID ARRAY PACKAGES; PLASTIC INTEGRATED CIRCUIT ENCAPSULATION TOOLING;

ELECTRONICS PACKAGING;

EID: 0032660362     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)