Material characterization of corner and edgebond epoxy adhesives for the improvement of board-level solder joint reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 125-133

  Wu, H L Henry ^a   Song, Fubin ^a   Lo, Jeffery C C ^a   Jiang, Tong ^a   Newman, Keith ^b   Lee, S W Ricky ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b SUN MICROSYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE STRENGTH; BOARD-LEVEL; BOARD-LEVEL RELIABILITY; CBGA PACKAGE; EPOXY ADHESIVES; FRACTURE STRENGTHS; INNOVATIVE MATERIALS; MATERIAL CHARACTERISTICS; MATERIAL CHARACTERIZATIONS; MECHANICAL RELIABILITY; MECHANICAL SHOCK; SELECTION METHODS; SHEAR TESTING; SOLDER JOINT RELIABILITY; SURFACE MATERIALS; TEST DEVICE;

ELECTRONICS PACKAGING; FAILURE ANALYSIS; FRACTURE; MATERIALS; SURFACE MOUNT TECHNOLOGY; SURFACE TESTING;

TESTING;

EID: 70349658305     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074006     Document Type: Conference Paper

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