Die-attach materials for high-density memory stacked die packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1569-1575

  Huang, Mark ^a   Gandhi, Jaspreet ^a   Shijian, Luo ^a   Jiang, Tom ^a  

^a MICRON TECHNOLOGY INC   (United States)

Author keywords

Adhesion; Die attach materials; Failure mechanism; Fracture toughness; Stacked die packaging

Indexed keywords

ADHESIVES; COMPUTER NETWORKS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FRACTURE; FRACTURE TOUGHNESS; GRAVIMETRIC ANALYSIS; LASER INTERFEROMETRY; THERMOGRAVIMETRIC ANALYSIS;

ADHESION; DIE ATTACH MATERIALS; DIE PACKAGING; FAILURE MECHANISM; STACKED DIE PACKAGING;

DIES;

EID: 51349091601     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550185     Document Type: Conference Paper

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