Processing and Reliability of Corner Bonded CSPs

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2003, Pages 299-304

  Toleno, Brian J ^a   Schneider, Josef ^a   Loctite, Henkel ^a  

^a NONE   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONIC EQUIPMENT; RELIABILITY; VIBRATIONS (MECHANICAL); ASSEMBLY; AUTOMOTIVE ENGINEERING; COST ENGINEERING; COSTS; ELECTRONICS PACKAGING; INDUSTRIAL ELECTRONICS; MANUFACTURE; MATERIALS TESTING; SHOCK TESTING; SOLDERING ALLOYS; TESTING;

BALL GRID ARRAYS (BGA);

CHIP SCALE PACKAGES;

AUTOMOTIVE ASSEMBLIES; CHIP-SCALE PACKAGING; CONDUCTING MATERIALS; ELECTRIC SHOCK; ELECTRONIC APPLICATION; MATERIALS RELIABILITIES; PROCESSING PARAMETERS; RELIABILITY PERFORMANCE;

EID: 0141788708     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Liu, J. et al. "CSP Underfill, Processing and Reliability", Proceedings from the 2002 APEX Technical Program, pp. S16-1-1 to S16-l-7San Diego, CA, January 19-24, 2002.
2. Young, S. J., "Underfilling BGA for Harsh Environment Deployment," Proceedings of the 1999 International Conference on High Density Packaging and MCMs, pp. 409-413, Denver, CO, April 6-9, 1999.
3. Tian, G. et al. "Corner Bonding of CSPs: Processing and Reliability", Proceedings from the 2003 APEX Technical Program, pp.S02-1-1 to S02-1-8, Anahiem, CA, 2003.
4. Burnette, T, et al. "Underfilled BGAs for Ceramic BGA Packages and Board Level Reliability," Proceedings of the 2000 Electronic Components and Technology Conference, pp. 1221-1226, Las Vegas, NV, May 30 - June 2, 2000.
5. Burnette, T., et al. "Underfilled BGAs for a variety of Plastic BGA Package Types and the Impact on Board-Level Reliability," Proceedings of the 2001 Electronic Components and Technology Conference, pp. 1045-1051, Orlando, FL, May 29 - June 1, 2001.
6. Schnieder, J., "New Underfill Materials for Assembly of CSP's - on Board-Level", Loctite RD&E Lab Report, 2002.