Effects of glue on the bend performance of flip chip packages

IEEE Transactions on Components and Packaging Technologies

Volumn 31, Issue 3, 2008, Pages 670-677

  Meyyappan, Karumbu ^a   McAllister, Alan ^a   Kochanowski, Mike ^a   Hsu, Ife ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Corner Glue; Finite element methods (FEMs); Modeling; Reliability; Semiconductor device packaging; Stress; Surface mounting; Testing

Indexed keywords

ADHESIVES; COMPUTER GRAPHICS EQUIPMENT; ELECTRIC CURRENTS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; GLUING; RELIABILITY; SHOCK TESTING; STRAIN RATE; UNCERTAIN SYSTEMS;

CORNER GLUE; FINITE-ELEMENT METHODS (FEMS); MODELING; SEMICONDUCTOR DEVICE PACKAGING; STRESS; SURFACE MOUNTING; TESTING;

GLUES;

EID: 54849142200     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.922006     Document Type: Article

References (8)

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