Effects of underfill adhesion on flip chip package reliability

Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC)

Volumn , Issue , 2004, Pages 96-101

  Sham, Man Lung ^a   Kim, Jang Kyo ^a   Lee, Ricky S W ^a   Wu, Jingshen ^a   Yuen, Matthew M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; FLIP CHIP DEVICES; INTERFACES (MATERIALS); MASKS; PASSIVATION; SILICON NITRIDE; THERMAL CYCLING;

FLIP CHIP ON BOARD (FCOB) PACKAGES; INTERFACIAL FAILURES; UNDERFILL ADHESION;

CHIP SCALE PACKAGES;

EID: 2342618696     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)

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