|
Volumn 42, Issue 12, 2009, Pages
|
Deposition of low dielectric constant SiOC films by using an atmospheric pressure microplasma jet
|
Author keywords
[No Author keywords available]
|
Indexed keywords
CHEMICAL VAPOUR DEPOSITION;
DIELECTRIC CONSTANTS;
FILM DEPOSITION RATES;
FUTURE GENERATIONS;
INTERCONNECT DIELECTRICS;
LOW DIELECTRIC CONSTANTS;
LOW PRESSURE PLASMA;
LOW PRESSURES;
MAXIMUM VALUES;
MICRO-PLASMA JET;
PRODUCTION PROCESS;
SIOC FILM;
TETRAETHOXYSILANES;
ARGON;
ATMOSPHERIC CHEMISTRY;
ATMOSPHERIC PRESSURE;
CERAMIC CAPACITORS;
DIELECTRIC WAVEGUIDES;
ELECTRIC FIELDS;
INTEGRATED CIRCUITS;
JETS;
PERMITTIVITY;
PLASMA DEPOSITION;
PLASMA DEVICES;
PLASMA DISPLAY DEVICES;
DIELECTRIC MATERIALS;
|
EID: 70149122315
PISSN: 00223727
EISSN: 13616463
Source Type: Journal
DOI: 10.1088/0022-3727/42/12/125503 Document Type: Article |
Times cited : (18)
|
References (18)
|