Aluminum oxynitride dielectrics for multilayer capacitors with higher energy density and wide temperature properties

Thin Solid Films

Volumn 518, Issue 1, 2009, Pages 366-371

  Bray, K R ^a   Wu, R L C ^a   Fries Carr, S ^b   Weimer, J ^b  

^a K Systems Corporation   (United States)

^b AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

Aluminum oxynitride; Dielectric; High temperature; Multilayer capacitors

Indexed keywords

ALUMINUM OXYNITRIDE; CAPACITOR DIELECTRICS; CHEMICAL INERTNESS; DC POWER; DECOMPOSITION TEMPERATURE; DEVICE PERFORMANCE; DIELECTRIC; DIELECTRIC STRENGTHS; GAS RATIO; HIGH ENERGY DENSITIES; HIGH RESISTIVITY; HIGH TEMPERATURE; HIGH THERMAL CONDUCTIVITY; HIGHER ENERGY DENSITY; LOW LOSS; MAGNETRON REACTIVE SPUTTERING; MULTILAYER CAPACITORS; PARALLEL PLATES; PULSE FREQUENCIES; SUBSTRATE TEMPERATURE; TEMPERATURE APPLICATIONS; TEMPERATURE DEPENDENT; TEMPERATURE PROPERTIES; TOTAL PRESSURE; VARIOUS SUBSTRATES;

ALUMINA; ALUMINUM; AMORPHOUS FILMS; CAPACITANCE; CAPACITORS; CERAMIC CAPACITORS; DIELECTRIC PROPERTIES; MULTILAYERS; NITRIDES; SUBSTRATES;

DIELECTRIC MATERIALS;

EID: 69549128076     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2009.06.052     Document Type: Article

References (15)

1. Rabuffi M., and Picci G. IEEE Trans. Plasma Sci. 30 (2002) 1939
2. Yim W.M., Stofko E.J., Zanzucchi P.J., Pankove J.I., Ettenberg M., and Gilbert S.L. J. Appl. Phys. 44 (1973) 292
3. Vispute R.D., Narayan J., and Budai J.D. Thin Solid Films 299 (1997) 94
4. Martin F., Muralt P., Dubois M.-A., and Pezous A. J. Vac. Sci. Technol., A 22 (2004) 361
5. Aardahl C.L., Rogers Jr. J.W., Yun H.K., Ono Y., Tweet D.J., and Hsu S.-T. Thin Solid Films 146 (1999) 174
6. Harris K.K., Gila B.P., Deroaches J., Lee K.N., MacKenzie J.D., Abernathy C.R., Ren F., and Pearton S.J. J. Electrochem. Soc. 149 (2002) G128
7. Dimitrova V., Manova D., and Valcheva E. Mater. Sci. Eng., B 68 (1999) 1
8. Schulte J., and Sobe G. Thin Solid Films 324 (1998) 19
9. Lee J.-W., and Cheng S.C.N. Thin Solid Films 358 (2000) 215
10. Jagannadham K., Sharma K., Wei Q., Kalyanraman R., and Narayan J. J. Vac. Sci. Technol. A 16 (1998) 2804
11. Leung T.T., and Ong C.W. Diamond Relat. Mater. 13 (2004) 1603
12. Kolodzey J., Chowdhury E.A., Adam T.N., Qui G., Rau I., Olowolafe J.O., Suehle J.S., and Chen Y. IEEE Trans. Electron Devices 47 (2000) 121
13. Bray K.R., Wu R.L.C., Fries-Carr S., Weimer J., and CARTS U.S.A. Proceedings of the 26th Symposium for Passive Components, Orlando, FL, U.S.A (2006) 161 April 3-6
14. Bray K.R., Wu R.L.C., Fries-Carr S., and Weimer J. In: Dogan F., and Kumta P.N. (Eds). Advances in Electronic and Electrochemical Ceramics: Proceedings of the 107th Annual Meeting of The American Ceramic Society, Baltimore, Maryland, U.S.A., April 10-13, 2005. Ceramic Transactions vol. 179 (2006) 45
15. Engelmark F., Westlinder J., Iriarte G.F., Katardjiev I.V., and Olsson J. IEEE Trans. Electron Devices 50 (2003) 1214