Integrated model and compensation of thermal errors of silicon microelectromechanical gyroscope

IEEE Transactions on Instrumentation and Measurement

Volumn 58, Issue 9, 2009, Pages 2923-2930

  Jiancheng, Fang ^a   Jianli, Li ^a  

^a BEIHANG UNIVERSITY   (China)

Author keywords

Error analysis; Error compensation; Gyroscope; Microelectromechanical devices; Temperature

Indexed keywords

BIAS TEMPERATURE; COMPENSATION METHOD; INTEGRATED COMPENSATION; INTEGRATED MODELS; MEMS GYROSCOPE; MICROELECTROMECHANICAL GYROSCOPES; MICROELECTROMECHANICAL SYSTEMS; ORDER OF MAGNITUDE; TEMPERATURE ERROR COMPENSATION; THERMAL ERROR; THERMAL ERROR COMPENSATION;

COMPOSITE MICROMECHANICS; ERROR ANALYSIS; GYROSCOPES; MEMS; MICROELECTROMECHANICAL DEVICES;

ERROR COMPENSATION;

EID: 69249213989     PISSN: 00189456     EISSN: None     Source Type: Journal    
DOI: 10.1109/TIM.2009.2016780     Document Type: Article

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