Understanding solidification kinetics and microstructural development of a lead-free composite solder

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 374, Issue 3, 2003, Pages 253-258

  Lin, D C ^a   Kuo, C Y ^a   Srivatsan, T S ^a   Wang, G X ^a  

^a University of Akron   (United States)

Author keywords

Cooling Rate; Lead free solder; Nanoparticles; Sn Ag; Solidification

Indexed keywords

COOLING; INTERMETALLICS; MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; SOLIDIFICATION; SURFACE TENSION; TIN;

COOLING RATE; COPPER NANOPOWDERS;

SOLDERING ALLOYS;

EID: 1842482031     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2003-42544     Document Type: Conference Paper

References (16)

1. John H. Lau, Solder joint reliability: theory and applications, Van Nostrand Reinhold, New York, pp1-30, 1991.
2. P. A .Bouleau, "Packaging for optoelectronic interconnections", JOM, Vol. 46, No.6, pp. 41-45, 1994.
3. Lee, N. -C, "Getting ready for lead-free solder", Soldering & Surface Mount Technology, Vol.9, pp. 65-69, 1997.
4. M. Abtew and G. Selvaduray, "Lead-free solders in microelectronics", Mater. Sci. Eng. A, Vol. 27, pp. 95-141, 2000.
5. H. Mavoori, "Dimensionally stable solders for optoelectronics and microelctronics", JOM, Vol. 52, pp. 29-32, 2000.
6. Y. Wu, J. A. Sees, C. Pouraghabagher, L. A. Foster, J. L. Marshall, E. G. Jacobs, and R. F. Pinizzotto, "The formation and growth of intermetallics in composite solder", J. Electronic Materials, Vol. 22, No. 7, pp. 769-777, 1993.
7. "Composite Solders," IBM Technical Disclosure Bulletin, Vol. 29 No.4, pp. 1573-1574, 1986.
8. J. L. Marshall, J. Calderon, J. Sees, G. Lucey, and J. S. Hwang, Composite Solders, IEEE Trans. on Components, Hybrids, and Manufacturing Technology, Vol. 14, No. 4, pp. 698-702, 1991.
9. S.M.L. Sastry, D.R. Frear, G. Kuo, and K.L. Jerina, "The Properties of Composite Solders," in The Mechanics of Solder Wetting and Spreading, edited by F. G. Yost, F. M. Hosking and D. R. Frear, Van Nostrand Reinhold, New York, pp. 299-350, 1993.
10. R. C. Reno and M. J. Panunto, "A Mossbauer Study of Tin-Based Intermetallics Formed During the Manufacture of Dispersion-Strengthened Composite Solders", J. Electronic Materials, Vol. 26, No.1, pp. 11-15, 1997.
11. J. L. Marshall, and J. Calderon, "Hard-particle reinforced composite solders Part 1: microcharacterisation", Soldering & Surface Mount Technology, Vol. 26, pp. 22-28, 1997.
12. M. McCormack, S. Jin, G.W. Kammlott, and H.S. Chen, "New Pb-free solder alloy with superior mechanical properties," Appl. Phys. Let., Vol. 63, pp. 15-17, 1993.
13. M. McCormack, S.Jin, G. W. Kammlott, "The design of new Pb-free solder alloy with improved properties," IEEE 0-7803-2137-5/95, 1995.
14. F. Guo, S. Choi, J.P. Lucas, and K.N. Subramanian, "Microstructural characterisation of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite solders," Soldering & Surface Mount Technology, Vol. 13, No.1, pp. 7-18, 2001.
15. S. Chada, A. Herrmann, W. Laub, R. Fournelle, D. Shangguan and A. Achari, "Microstructural Investigation of Sn-Ag and Sn-Pb-Ag Solder Joints," Soldering & Surface Mount Technology, Vol. 26, pp. 9-13, 1997.
16. G. Humpston and D. M. Jacobson, Principles of soldering and brazing, AMS International, pp. 31-69, 1993.