Stencil printing technology for wafer level bumping at sub-100 micron pitch using Pb-free alloys

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 848-854

  Kay, R W ^a   De Gourcuff, E ^b   Desmulliez, M P Y ^a,b   Jackson, G J ^c   Steen, H A H ^c   Liu, C ^d   Conway, P P ^d  

^a MicroStencil Limited   (United Kingdom)

^b HERIOT WATT UNIVERSITY   (United Kingdom)

^c Henkel Technologies   (United Kingdom)

^d LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

BUMPS; PRINT CONSISTENCY; REFLOWING;

ADHESIVE PASTES; GEOMETRY; PARAMETER ESTIMATION; PARTICLE SIZE ANALYSIS; SOLDERING ALLOYS;

PRINTING;

ADHESIVES; PARTICLE SIZE; PRINTING; SOLDERING;

EID: 24644468680     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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