Electrical characteristics of fine pitch flip chip solder joints fabricated using low temperature solders

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1952-1958

  Kang, Un Byoung ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; EPOXY RESINS; ETCHING; EUTECTICS; FABRICATION; INTERMETALLICS; LIQUID CRYSTAL DISPLAYS; LOW TEMPERATURE ENGINEERING; MAGNETRON SPUTTERING; PHOTOLITHOGRAPHY; SOLDERING; THERMAL CYCLING;

CHEMICAL ETCHING; CONTACT RESISTANCE; ELECTRICAL CHARACTERISTICS; GLASS SUBSTRATE;

SOLDERED JOINTS;

EID: 10444233506     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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