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Volumn , Issue , 2007, Pages 113-118
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ECD wafer bumping and packaging for pixel detector applications
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Author keywords
ATLAS; Fine pitch assembly; Imaging detectors; Particle tracking; Pixel detector; Wafer bumping
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Indexed keywords
ATLAS;
FINE PITCH;
IMAGING DETECTOR;
PARTICLE TRACKING;
PIXEL DETECTOR;
WAFER BUMPING;
CHIP SCALE PACKAGES;
ELECTROCHEMICAL SENSORS;
EXHIBITIONS;
MICROELECTRONICS;
PACKAGING;
PIXELS;
PROCESSING;
SENSORS;
SUBSTRATES;
READOUT SYSTEMS;
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EID: 84875284687
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (4)
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References (7)
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