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Volumn , Issue , 2007, Pages 113-118

ECD wafer bumping and packaging for pixel detector applications

Author keywords

ATLAS; Fine pitch assembly; Imaging detectors; Particle tracking; Pixel detector; Wafer bumping

Indexed keywords

ATLAS; FINE PITCH; IMAGING DETECTOR; PARTICLE TRACKING; PIXEL DETECTOR; WAFER BUMPING;

EID: 84875284687     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (4)

References (7)
  • 1
    • 15844416836 scopus 로고    scopus 로고
    • Pixel detectors for tracking and their spin-off in imaging
    • Wermes N. "Pixel Detectors for Tracking and Their Spin-Off in Imaging," Nuclear Instruments & Methods in Physics Research A, No. 541 (2005), pp. 150-165.
    • (2005) Nuclear Instruments & Methods in Physics Research A , Issue.541 , pp. 150-165
    • Wermes, N.1
  • 2
    • 10444260501 scopus 로고    scopus 로고
    • Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps
    • Las Vegas, June
    • Hutter, M. et al: "Assembly and Reliability of Flip Chip Solder Joints Using Miniaturized Au/Sn Bumps", Proceddings 54th Electronic Components and Technology Conference, Las Vegas, June, 2004, p 49-57.
    • (2004) th Electronic Components and Technology Conference , pp. 49-57
    • Hutter, M.1
  • 3
    • 28044441348 scopus 로고    scopus 로고
    • 3D integration of CMOS transistors with ICV-SLID technology
    • Microelectr. Engineering
    • Wieland, R. et al: "3D Integration of CMOS Transistors with ICV-SLID Technology", Proceedings of Materials for Advanced Metallization Conference 2005, in Microelectr. Engineering 82 (2005), p. 529-533
    • (2005) Proceedings of Materials for Advanced Metallization Conference 2005 , vol.82 , pp. 529-533
    • Wieland, R.1
  • 4
    • 33747204833 scopus 로고    scopus 로고
    • Flip chip bumping technology - Status and update
    • Wolf, et al: "Flip Chip Bumping technology - Status and Update", Nuclear Instruments & Methods in Physics Research A, Vol. 565/1 (2006), p. 290-295
    • (2006) Nuclear Instruments & Methods in Physics Research A , vol.565 , Issue.1 , pp. 290-295
    • Wolf1
  • 5
    • 33845570883 scopus 로고    scopus 로고
    • Conformance of ECD wafer bumping to future demands on CSP, 3D integration and MEMS
    • San Diego, CA, May/June
    • Dietrich, et al: "Conformance of ECD Wafer Bumping to Future Demands on CSP, 3D Integration and MEMS", Proceedings of the 56th Electronic Components and Technology Conference, San Diego, CA, May/June 2006.
    • (2006) Proceedings of the 56th Electronic Components and Technology Conference
    • Dietrich1
  • 7
    • 33747164440 scopus 로고    scopus 로고
    • Radiation hard diamond sensors for future tracking applications
    • Kagan, et al, "Radiation Hard Diamond Sensors for Future Tracking Applications," Nuclear Instrument & Methods in Physics Research A, Vol 565 (2006), p. 278-283
    • (2006) Nuclear Instrument & Methods in Physics Research A , vol.565 , pp. 278-283
    • Kagan1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.