Thermal cycling reliability of Cu/SnAg double-bump flip-chip assemblies for 100um pitch applications

EMAP 2007 - International Conference on Electronic Materials and Packaging 2007

Volumn , Issue , 2007, Pages

  Son, Ho Young ^a   Kim, Il Ho ^a   Lee, Soon Bok ^a   Jung, Gi Jo ^b   Park, Byung Jin ^b   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Nepes Corperation   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; ACOUSTIC MICROSCOPES; COLUMNS (STRUCTURAL); COPPER; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; MICROSCOPES; PACKAGING MATERIALS; PLASTIC DEFORMATION; PLASTICS; QUALITY ASSURANCE; RELIABILITY; RELIABILITY ANALYSIS; SCANNING; SCANNING ELECTRON MICROSCOPY; STRAIN; THERMAL CYCLING; TITANIUM;

ELECTRONIC MATERIALS AND PACKAGING; FLIP-CHIP ASSEMBLIES; INTERNATIONAL CONFERENCES;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 51249101107     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2007.4510312     Document Type: Conference Paper

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