Design optimization of needle geometry for wafer-level probing test

IEEE Transactions on Components and Packaging Technologies

Volumn 32, Issue 2, 2009, Pages 435-439

  Shih, Meng Kai ^a   Lai, Yi Shao ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

Finite element analysis; Optimization; Scrub length; Taguchi method; Wafer level probing test

Indexed keywords

BEAM LENGTH; DESIGN OPTIMIZATION; FINITE-ELEMENT ANALYSIS; GEOMETRICAL DESIGNS; GEOMETRICAL FACTORS; ORTHOGONAL ARRAY; PROBE CARDS; PROBE TIPS; PROPER DESIGN; SCRUB LENGTH; TAPER LENGTH; TIP SHAPE; WAFER-LEVEL PROBING TEST;

NEEDLES; OPTIMIZATION; PROBES; QUALITY ASSURANCE; QUALITY CONTROL; QUALITY FUNCTION DEPLOYMENT; TAGUCHI METHODS; TESTING; TOTAL QUALITY MANAGEMENT;

FINITE ELEMENT METHOD;

EID: 68349131423     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2008.2005839     Document Type: Article

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