Developing an analytic methodology to accurately predict probing depth in integrated circuit structures

Journal of Electronic Materials

Volumn 35, Issue 2, 2006, Pages 257-265

  Chen, K M ^a   Chiang, K N ^b  

^a UNITED MICROELECTRONICS CORPORATION   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Flip chip; Nanoindenter; Probe; Under bump metallurgy (UBM); Wafer

Indexed keywords

FLIP CHIP; NANOINDENTERS; UNDER BUMP METALLURGY (UBM); WAFERS;

ALUMINUM; ELASTIC MODULI; ION BEAMS; PROBES; THIN FILMS;

INTEGRATED CIRCUITS;

EID: 33644931904     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692444     Document Type: Conference Paper

References (12)

1. Q. Tan, C. Beddingfield, and A. Mistry, 1999 IEEE/CPMT Int. Electronics Manufacturing Technology Symp. (Piscataway, NJ: IEEE, 1999), pp. 320-324.
2. K.L. Johnson, Contact Mechanics (Cambridge, United Kingdom: Cambridge University Press, 1985), pp. 56-70.
3. X. Li and B. Bhushan, IEEE Trans. Magn. 37, 1616 (2001).
4. T.A. Venkatesh, K.J. Van Vliet, A.E. Giannakopoulos, and S. Suresh, Scripta Mater. 42, 833 (2000).
5. T. Sugimoto and T. Kawaaguchi, IEEE Trans. Industrial Electron. 44, 696 (1997).
6. M.S. Guzman, M. Hack, and G. Neubauer, IEEE Int. Reliability Physics Symp. (Piscataway, NJ: IEEE, 1994), pp. 108-113.
7. W.C. Oliver and G.M. Pharr, J. Mater. Res. 7, 1564 (1992).
8. K.W. McElhaney, J.J. Vlassak, W.D. Nix, "Determination of Indenter Tip Geometry and Indentation Contact Area for Depth-sensing Indentation Experiments," Department of Materials Science and Engineering, Stanford University, www-mse.stanford.edu.
9. M. O'Hern, "Developments in Diamond Indentation and Scratch Tips: Introducing the AccuTip Family of Diamond Tips," www.mts.com/nano/XP_specs, 2002.
10. "TestWorks 4 Software for Nanoindentation Systems," Version 012, Document No. D1418XPA-10629, MTS Manual (Eden Prairie, MN: MTS Systems Corp., 1999), pp. 1-65.
11. D.G. Altenpohl, Aluminum: Technology, Applications, and Environment (Warrendale, PA: TMS, 1999), p. 230.
12. "What is Cobra™," VTech Japan Presentation Materials (Arlington Heights, IL: VTech Electronics North America, LLC, 2001).