Nanoindentation of shape memory polymer networks

Polymer

Volumn 48, Issue 11, 2007, Pages 3213-3225

  Wornyo, Edem ^a   Gall, Ken ^b,c   Yang, Fuzheng ^c   King, William ^c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Crosslinking; Nanoindentation; Shape memory polymers

Indexed keywords

CROSSLINKING; MOLECULAR WEIGHT; NANOINDENTATION; PLASTIC DEFORMATION; POLYETHYLENE GLYCOLS; SUPERCONDUCTING TRANSITION TEMPERATURE; SYNTHESIS (CHEMICAL);

AMBIENT TEMPERATURE HARDNESS; CROSSLINKING DENSITY; POLYMER NETWORKS; THERMALLY INDUCED RECOVERY;

SHAPE MEMORY EFFECT;

COPOLYMER; CROSS LINKING; CROSS LINKING AGENT; ELASTIC MODULUS; GLASS TRANSITION TEMPERATURE; MOLECULAR WEIGHT; MONOMER; NANOTECHNOLOGY; POLYACRYLATE; POLYETHYLENE GLYCOL; SHAPE MEMORY MATERIAL;

EID: 34248212182     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2007.03.029     Document Type: Article

References (60)

1. Shmulewitz A., Langer R., and Patton J. Nature Biotechnology 24 3 (2006) 277-280
2. Yu Q., Zhang J.Z., Cheng M.L., and Zhu S.P. Macromolecular Chemistry and Physics 207 3 (2006) 287-294
3. Small W., Metzger M.F., Wilson T.S., and Maitland D.J. IEEE Journal of Selected Topics in Quantum Electronics 11 4 (2005) 892-901
4. Haller I., and Stewart K.J. Journal of Vacuum Science and Technology B: Microelectronics Processing and Phenomena (USA) (1991) 3370-3373 Seattle, WA, USA
5. Rauter H., Matyushin V., Alguel Y., Pittner F., and Schalkhammer T. Macromolecular Symposia 217 (2004) 109-133
6. Yang Z.H., Hu J.L., Liu Y.Q., and Yeung L.Y. Materials Chemistry and Physics 98 2-3 (2006) 368-372
7. Collie G.J., and Black I. Proceedings of the Institution of Mechanical Engineers Part E - Journal of Process Mechanical Engineering 219 4 (2005) 345-355
8. Feger C. Proceedings of fourth international symposium on advanced packaging materials processes, properties and interfaces (Cat. no. 98EX153) (1998), IEEE, Braselton, GA, USA p. 77-81
9. Speidell J.L., Pulaski D.P., and Patel R.S. IBM Journal of Research and Development 41 1-2 (1997) 143-149
10. Shih D.Y., Lewis J., Yeh H., Graham W., Paraszczak J., Nunes S., et al. ISHM '92 proceedings. Proceedings of the 1992 international symposium on microelectronics (SPIE Vol. 1847) (1992), Int. Soc. Hybrid Microelectron, San Francisco, CA, USA p. 376-83
11. Umbach C.P., Broers A.N., Willson C.G., Koch R., and Laibowitz R.B. Journal of Vacuum Science and Technology B: Microelectronics Processing and Phenomena (USA) (1988) 319-322 Woodland Hills, CA, USA
12. Hatzakis M., Shaw J., Babich E., and Paraszczak J. Journal of Vacuum Science and Technology B: Microelectronics Processing and Phenomena (USA) (1988) 2224-2228 Fort Lauderdale, FL, USA
13. Babich E., Shaw J., Hatzakis M., Paraszczak J., Witman D., and Grenon B.J. Microelectronic Engineering (Netherlands) (1986) 299-313 Interlaken, Switzerland
14. Saarela V., Franssila S., Tuomikoski S., Marttila S., Ostman P., Sikanen T., et al. Sensors and Actuators B: Chemical 114 1 (2006) 552-557
15. Knoll A., Bachtold P., Bonan J., Cherubini G., Despont M., Drechsler U., et al. Microelectronic Engineering 83 4-9 (2006) 1692-1697
16. Gall K., Yakacki C.M., Liu Y.P., Shandas R., Willett N., and Anseth K.S. Journal of Biomedical Materials Research Part A 73 3 (2005) 339-348
17. Sipahigil O., Torres-Lugo M., and Peppas N.A. STP Pharma Sciences 12 6 (2002) 345-350
18. Kallrot M., Edlund U., and Albertsson A.C. Biomaterials 27 9 (2006) 1788-1796
19. Feng W., Brash J.L., and Zhu S. Biomaterials 27 6 (2006) 847-855
20. Frost R.L., and Mendelovici E. Journal of Colloid and Interface Science 294 1 (2006) 47-52
21. Harbers G.M., and Healy K.E. Journal of Biomedical Materials Research Part A 75 4 (2005) 855-869
22. Mathieu L.M., Mueller T.L., Bourban P.-E., Pioletti D.P., Muller R., and Manson J.-A.E. Biomaterials 27 6 (2006) 905-916
23. Nagesh K., and Ramakrishnan S. Synthetic Metals 155 2 (2005) 320-323
24. Reddy S.K., Sebra R.P., Anseth K.S., and Bowman C.N. Journal of Polymer Science Part A: Polymer Chemistry 43 10 (2005) 2134-2144
25. Ward J.H., Shahar A., and Peppas N.A. Polymer 43 6 (2002) 1745-1752
26. Lendlein A., Jiang H.Y., Junger O., and Langer R. Nature 434 7035 (2005) 879-882
27. Mohr R., Kratz K., Weigel T., Lucka-Gabor M., Moneke M., and Lendlein A. Proceedings of the National Academy of Sciences 103 10 (2006) 3540-3545
28. Huang W.M., Lee C.W., and Teo H.P. Journal of Intelligent Material Systems and Structures 17 8-9 (2006) 753-760
29. Schmidt A.M. Macromolecular Rapid Communications 27 14 (2006) 1168-1172
30. Liu G., Guan C., Xia H., Guo F., Ding X., and Peng Y. Macromolecular Rapid Communications 27 14 (2006) 1100-1104
31. Gall K., Kreiner P., Turner D., and Hulse M. Journal of Microelectromechanical Systems 13 3 (2004) 472-483
32. Liu Y.P., Gall K., Dunn M.L., and McCluskey P. Mechanics of Materials 36 10 (2004) 929-940
33. Wei Z.G., Sandstrom R., and Miyazaki S. Journal of Materials Science 33 15 (1998) 3743-3762
34. Wei Z.G., Sandstrom R., and Miyazaki S. Journal of Materials Science 33 15 (1998) 3763-3783
35. Duncheon C. Industrial Robot: An International Journal 32 6 (2005) 452-455
36. Loubet J.L., Georges J.M., Marchesini O., and Meille G. Journal of Tribology-Transactions of the ASME 106 1 (1984) 43-48
37. Jiang S., Li X., Guo S., Hu Y., Yang J., and Jiang Q. Smart Materials and Structures 14 4 (2005) 769-774
38. Shaw G.A., Trethewey J.S., Johnson A.D., Drugan W.J., and Crone W.C. Advanced Materials 17 9 (2005) 1123-1127
39. Yuan Z.Y., Xu D., Ye Z.C., and Cai B.C. Journal of Materials Science and Technology 21 3 (2005) 319-323
40. VanLandingham M.R., Villarrubia J.S., Guthrie W.F., and Meyers G.F. Macromolecular Symposia 167 (2001) 15-43
41. Briscoe B.J., Fiori L., and Pelillo E. Journal of Physics D: Applied Physics 31 19 (1998) 2395-2405
42. Shen L., Phang I.Y., Liu T.X., and Zeng K.Y. Polymer 45 24 (2004) 8221-8229
43. Klapperich C., Komvopoulos K., and Pruitt L. Journal of Tribology-Transactions of the ASME 123 3 (2001) 624-631
44. Wright-Charlesworth D.D., Miller D.M., Miskioglu I., and King J.A. Journal of Biomedical Materials Research Part A 74 3 (2005) 388-396
45. Gregory J.R., and Spearing S.M. Composites Science and Technology 65 3-4 (2005) 595-607
46. Xu W.H., Xiao Z.Y., and Zhang T.Y. Materials Letters 59 17 (2005) 2153-2155
47. Yu S.Z., Wong T.K.S., Hu X., Wei J., and Yong M.S. Microelectronic Engineering 77 2 (2005) 125-131
48. Tweedie C.A., and Van Vliet K.J. Journal of Materials Research 21 6 (2006) 1576-1589
49. Lee B.S., Chun B.C., Chung Y.C., Sul K.I., and Cho J.W. Macromolecules 34 18 (2001) 6431-6437
50. Tobushi, Hayashi, Hoshio, and Miwa. Smart Materials and Structures 15 4 (2006) 1033-1038
51. Lim G., Park K., Sugihara M., Minami K., and Esashi M. Sensors and Actuators A: Physical 56 1-2 (1996) 113-121
52. Nelson B.A., King W.P., and Gall K. Applied Physics Letters 86 10 (2005)
53. Oliver W.C., and Pharr G.M. Journal of Materials Research 7 6 (1992) 1564-1583
54. Elliott J.E., and Bowman C.N. Polymer Reaction Engineering 10 1-2 (2002) 1-19
55. Schwaller P., Haug F.J., Michler J., and Patscheider J. Advanced Engineering Materials 7 5 (2005) 318-322
56. Malzbender J., den Toonder J.M.J., Balkenende A.R., and de With G. Materials Science and Engineering R: Reports 36 2-3 (2002) 47-103
57. Vanlandingham M.R., McKnight S.H., Palmese G.R., Elings J.R., Huang X., Bogetti T.A., et al. Journal of Adhesion 64 1-4 (1997) 31-59
58. van Melick H.G.H., Govaert L.E., and Meijer H.E.H. Polymer 44 8 (2003) 2493-2502
59. Andreas Lendlein S.K. Angewandte Chemie International Edition 41 12 (2002) 2034-2057
60. Tobushi H., Matsui R., Hayashi S., and Shimada D. Smart Materials and Structures 13 4 (2004) 881-887