A micromachined Pirani gauge with dual heat sinks

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 4, 2005, Pages 619-625

  Chae, Junseok ^a,b   Stark, Brian H ^a   Najafi, Khalil ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

^b Arizona State University   (United States)

Author keywords

Microelectromechanical systems (MEMS); Packaging; Pirani gauge; Pressure sensor

Indexed keywords

ELECTRONICS PACKAGING; HEAT SINKS; MATHEMATICAL MODELS; MICROMACHINING; MICROSENSORS; PRESSURE GAGES; SENSITIVITY ANALYSIS; VACUUM APPLICATIONS;

DUAL HEAT SINKS; LEAK TESTING; MICROELECTROMECHANICAL SYSTEMS (MEMS); PIRANI GAUGE; PRESSURE SENSOR;

MICROELECTROMECHANICAL DEVICES;

EID: 28444480711     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.858316     Document Type: Article

References (19)

1. D. Sparks, G. Queen, R. Weston, G. Woodward, M. Putty, L. Jordan, S. Zarabadi, and K. Jayakar, "Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder," J. Micromech. Microeng., vol. 11, pp. 630-634, 2001.
2. Y.-T. Cheng, W.-T. Hsu, K. Najafi, C. T.-C. Nguyen, and L. Lin, "Vacuum packaging technology using localized aluminum/ silicon-to-glass bonding," J. Microelectromech. Syst., vol. 11, pp. 556-565, 2002.
3. Verh. Dtsch. Phys., vol. 8, pp. 686-686, 1906.
4. J. F. O'Hanlon, A User's Guide to Vacuum Technology. Hoboken, N.J: Wiley-Interscience, 2003.
5. J. H. Leck, Pressure Measurement in Vacuum Systems. London, U.K.: Chapman & Hall, 1967.
6. W. J. Alvesteffer, D. C. Jacobs, and D. H. Baker, "Miniaturized thin film thermal vacuum sensor," J. Vacuum Sci. Technol. A: Vacuum, Surfaces, Films, vol. 13, pp. 2980-2980, 1995.
7. J.-S. Shie, B. C. S. Chou, and Y.-M. Chen, "High performance Pirani vacuum gauge," J. Vacuum Sci. Technol. A: Vacuum, Surfaces, Films, vol. 13, pp. 2972-2972, 1995.
8. C. H. Mastrangelo and R. S. Muller, "Microfabricated thermal absolute-pressure sensor with on-chip digital front-end processor," IEEE J. Solid-State Circuits, vol. 26, no. 12, pp. 1998-2007, Dec. 1991.
9. M. Waelti, N. Schneeberger, O. Paul, and H. Baltes, "Package quality testing using integrated pressure sensor," Int. J. Microcircuits Electron. Packag., vol. 22, pp. 49-56, 1999.
10. B. H. Stark, Y. Mei, C. Zhang, and K. Najafi, "A doubly anchored surface micromachined Pirani gauge for vacuum package characterization," in Proc. IEEE 16th Annu. Int. Conf. Micro Electo Mechanical Systems, Kyoto, Japan, Jan. 19-23, 2003, pp. 506-509.
11. J. Chae, J. M. Giachino, and K. Najafi, "Wafer-level vacuum package with vertical feedthroughs," in Proc. 18th IEEE Int. Conf. Microelectromechanical Systems (MEMS): MEMS Technical Dig., Miami, FL, Jan.-Feb. 30-3, 2005, pp. 548-551.
12. H.-L. Chau and K. D. Wise, "An ultraminiature solid-state pressure sensor for a cardiovascular catheter," IEEE Trans. Electron Devices, vol. 35, no. 12, pp. 2355-2362, Dec. 1988.
13. J. Chae, H. Kulah, and K. Najafi, "A monolithic three-axis silicon capacitive accelerometer with micro-g resolution," in Proc. 12th Int. Conf. TRANSDUCERS, Solid-State Sensors, Actuators, Microsystems, vol. 1, 2003, pp. 81-84.
14. H. V. Ubisch, "On the conduction of heat in rarefied gases and its manometric application," Appl. Sci. Res., vol. A2, pp. 364-430, 1948.
15. B. G. Dicking, "The effect of accommodation on heat conduction through gases," Proc. R. Soc. A, pp. 517-540, 1934.
16. C. H. Mastrangelo, "Thermal Applications of Microbridges," Ph.D. dissertation, Dept. Elect. Eng. Comp. Sci., Univ. California, Berkeley, 1991.
17. S. M. Sze, Semiconductor Sensors. New York: Wiley, 1994.
18. J. Chae, B. H. Stark, and K. Najafi, "A micromachined Pirani gauge with dual heat sinks," in Proc, 17th IEEE Int. Conf. Microelectromechanical Systems (MEMS): Maastricht MEMS Technical Dig., Maastricht, The Netherlands, Jan. 25-29, 2004, pp. 532-535.
19. B. Stark, "Thin Film Technologies for Hermetic and Vacuum Packaging of MEMS," Ph.D. dissertation, Dept. Elect. Eng. Comp. Sci, Univ. Michigan, Ann Arbor, 2004.