Modal analysis of multi-layer structure for chemical mechanical polishing process

International Journal of Advanced Manufacturing Technology

Volumn 37, Issue 1-2, 2008, Pages 83-91

  Chiu, Jinn Tong ^a   Lin, Yeou Yih ^a  

^a DE LIN INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Finite element method; Modal analysis; Nonuniformity; Stress; Wafer

Indexed keywords

BOUNDARY CONDITIONS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MODAL ANALYSIS; STATIC ANALYSIS; STRESS CONCENTRATION;

CHEMICAL MECHANICAL POLISHING PROCESS; MULTILAYER STRUCTURES; NONUNIFORMITY; STATIC LOADS;

CHEMICAL POLISHING;

EID: 43249098368     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-007-0960-9     Document Type: Article

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