Effects of pad grooves on chemical mechanical planarization

Journal of the Electrochemical Society

Volumn 154, Issue 6, 2007, Pages

  Wang, Yao Chen ^a   Yang, Tian Shiang ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DEBRIS; NUMERICAL METHODS; PARTICLES (PARTICULATE MATTER);

CONTACT MECHANICS MODELS; GROOVED PADS; SLURRY FLOW;

SLURRIES;

EID: 34547174875     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2716558     Document Type: Article

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