A study on the stress and nonuniformity of the wafer surface for the chemical-mechanical polishing process

International Journal of Advanced Manufacturing Technology

Volumn 22, Issue 5-6, 2003, Pages 401-409

  Lin, Yeou Yih ^a   Lo, Ship Peng ^a  

^a DE LIN INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Chemical mechanical polishing; Finite element method; Nonuniformity; Von Mises stress

Indexed keywords

DEFORMATION; ELASTIC MODULI; POTENTIAL ENERGY; STRESS CONCENTRATION; SURFACE PROPERTIES; THIN FILMS;

CARRIER FILMS; CARRIER LOAD;

CHEMICAL MECHANICAL POLISHING;

EID: 0344035524     PISSN: 02683768     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00170-003-1544-y     Document Type: Article

References (13)

1. Runnels SR, Renteln P (1993) Modeling the effect of polish pad deformation on wafer surface stress distributions during chemical-mechanical polishing. Dielect Sci Technol 6:110-121
2. Runnels SR, Eyman LM (1994) Tribology analysis of chemical-mechanical polishing. J Electrochem Soc 141(6): 1698-1701
3. Kaanta CW, Landis HS (1991) Radial uniformity control of semiconductor wafer polishing. US Patent 5,036,630, 6 August 1991
4. Warnock J (1991) A two-dimensional process model for CMP planarization. J Electrochem Soc 138(8):2398-2402
5. Sivaram S, Tolles R, Bath H, Lee E, Leggett R (1992) Chemical mechanical polishing of inter-level dielectrics: models for removal rate and planarity. Technical Report, SEMATECH, Austin, TX
6. Wang D, Lee J, Holland K, Bibby T, Beaudoin S, Cale T (1997) Von Mises stress in chemical-mechanical polishing processes. J Electrochem Soc 144(3): 1122-1127
7. Srinivasa-Murthy C, Wang D, Beaudoin SP, Bibby T, Holland K, Cale TS (1997) Stress distribution in chemical-mechanical polishing. Thin Solid Film 308:533-537
8. Lin YY, Lo SP (2003) Study on finite element model for chemical mechanical polishing process. Int J Adv Manufact Technol (in press)
9. Baker AR (1997) The origin of the edge effects in CMP. Proc Electrochem Soc 96(22):228-237
10. Preston F (1927) Optimization of computer controlled polishing. Glass Tech 11:214-219
11. Yu TK, Yu CC, Orlowski M (1993) A statistical polishing pad model for chemical-mechanical polishing. IEDM Tech Dig pp 865-868
12. Rao SS (1989) The finite element method in engineering. Pergamon, Oxford, UK
13. Galyer JFW, Shotbolt CR (1993) Metrology for engineers. Cassell, London