Multivariable control of multizone chemical mechanical polishing

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 4, 2004, Pages 1679-1687

  Shiu, Sheng Jyh ^a   Yu, Cheng Ching ^a   Shen, Shih Haur ^b  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b Applied Materials Taiwan   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL METHODS; CONTROL EQUIPMENT; DECOMPOSITION; ELECTROCHEMISTRY; ELECTROPLATING; FEEDBACK CONTROL; MULTIVARIABLE CONTROL SYSTEMS; REGRESSION ANALYSIS; SILICON WAFERS; SURFACE PROPERTIES;

DAMASCENE; ELECTROCHEMICAL PLATING (ECP); MULTIVARIABLE CONTROL; SINGULAR VALUE DECOMPOSITION (SVD);

CHEMICAL MECHANICAL POLISHING;

EID: 4944225579     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1761483     Document Type: Article

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