Microstructure, wettability and mechanical properties of Sn-Zn-Cu lead free solder

Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals

Volumn 14, Issue 10, 2004, Pages 1694-1699

  Xie, Hai Ping ^a   Yu, Da Quan ^a   Ma, Hai Tao ^a   Wang, Lai ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Lead free solder; Microstructure; Sn Zn Cu; Tensile strength; Wettability

Indexed keywords

EID: 10444269351     PISSN: 10040609     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (20)