Nanomechanical characterization of single micron-sized polymer particles

Journal of Applied Polymer Science

Volumn 113, Issue 3, 2009, Pages 1398-1405

  He, J Y ^a   Zhang, Z L ^a   Kristiansen, H ^b  

^a NORWEGIAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Norway)

^b Mosaic Solutions AS and Conpart AS   (Norway)

Author keywords

Amorphous; Crosslinking; Mechanical properties; Strain; Stress

Indexed keywords

AMORPHOUS; AMORPHOUS POLYMERS; ANISOTROPIC CONDUCTIVE ADHESIVES; APPLIED LOADS; COMPRESSION STRESS; FLAT PUNCHES; MATERIAL RESPONSE; MECHANICAL CHARACTERIZATIONS; NANOMECHANICAL CHARACTERIZATION; PARTICLE SIZE EFFECT; POLYMER PARTICLES; SHARP TIP; SINGLE POLYMERS; STRAIN LEVELS; STRESS-STRAIN BEHAVIORS;

ADHESIVE JOINTS; CONDUCTING POLYMERS; MECHANICAL PROPERTIES; POLYMERS; STRESSES;

STRAIN;

ADHESIVE AGENT; ANISOTROPY; COMPRESSION; DEFORMATION; MECHANICAL PROPERTY; PARTICLE SIZE; POLYMER; STRESS-STRAIN PROPERTY;

EID: 67349264529     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.29913     Document Type: Article

References (38)

1. Ahmad, H. Colloid Polym Sci 2003, 281, 476.
2. Miled, K.; Sab, K.; Roy, R. L. Mech Mater 2007, 39, 222.
3. Cook, G.; Rudin, A.; Plumtree, A. J Appl Polym Sci 1993, 48, 75.
4. Dagli, G.; Argon, A. S.; Cohen, R. E. Polymer 1995, 36, 2173.
5. Alfarraj, A.; Nauman, E. B. Polymer 2004, 45, 8435.
6. Kuboki, T.; Jar, P. Y. B.; Takahashi, K.; Shinmura, T. Macromolecules 2002, 35, 3584.
7. Lai, Z.; Liu, J. IEEE T Compon Pack T 1996, 19, 644.
8. Kristiansen, H.; Liu, J. IEEE T Compon Pack T 1998, 21, 208.
9. Liu, J.; Tolvgård, A.; Malmodin, J.; Lai, Z. IEEE T Compon Pack T 1999, 22, 186.
10. Kristiansen, H.; Gronlund, T.; Liu, J. In Proceedings of the 6th IEEE CPMT HDP'4; 2004; p 259.
11. Paik, K. W.; Kwon, W. S. In Proceedings of 10th International Symposium on Advanced Packaging Materials (IEEE), Processes, Properties and Interfaces; 2005; p 214.
12. Kim, D. O.; Jin, J. H.; Shon, W. I.; Oh, S. H. J Appl Polym Sci 2007, 105, 585.
13. Galloway, J.; Syed, A.; Kang, W.; Kim, J. Y.; Cannis, J.; Ka, Y. H. IEEE T Compon Pack T 2005, 28, 297.
14. Dou, G.; Whalley, D.; Liu, C. In Proceedings of IEEE 56th Electronic Components and Technology Conference; 2006; p 932.
15. Kwon, W. S.; Paik, K. W. IEEE T Compon Pack T 2006, 29, 528.
16. Kristiansen, H.; Zhang, Z. L.; Liu, J. In Proceedings of 10th International Symposium on Advanced Packaging Materials (IEEE), Processes, Properties and Interfaces; 2005; p 209.
17. Chin, M.; Iyer, K. A.; Hu, S. J. IEEE T Compon Pack T 2004, 27, 317.
18. Yim, M. J.; Kim, H. J.; Chung, C. K.; Paik, K. W. In Proceedings of IEEE 56th Electronic Components and Technology Conference; 2006; p 338.
19. Wang, X.; Wang, Y.; Chen, G.; Liu, J.; Lai, Z. IEEE T Compon Pack T 1998, 21, 248.
20. Fu, Y.; Wang, Y.; Wang, X.; Liu, J.; Lai, Z.; Chen, G.; Willander, M. IEEE T Adv Packaging 2000, 23, 15.
21. He, J. Y.; Zhang, Z. L.; Kristiansen, H. Int J Mater Res 2007, 98, 389.
22. Kim, D. O.; Jin, J. H. J Appl Polym Sci 2007, 105, 783.
23. Kim, D. O.; Jin, J. H. J Appl Polym Sci 2007, 104, 2350.
24. Dou, G.; Whalley, D. C.; Liu, C. Appl Phys Lett 2008, 92, 104108.
25. Ugelstad, J.; Berge, A.; Ellingsen, T.; Schmid, R.; Nilsen, T. N.; Mork, P. C. Prog Polym Sci 1992, 17, 87.
26. Liu, K. K. J Phys D Appl Phys 2006, 39, R189.
27. Johnson, K. L. Contact Mechanics; University Press: Cambridge, 2003.
28. Liu, K. K.; Williams, D. R.; Briscoe, B. J. J Phys D Appl Phys 1998, 31, 294.
29. Tatara, Y. J Eng Mater Tech ASME 1989, 111, 163.
30. Tatara, Y. J Eng Mater Tech ASME 1991, 113, 285.
31. Zhang, Z. L.; Kristiansen, H.; Liu, J. Comput Mater Sci 2007, 39, 305.
32. Chow, T. S. Macromolecules 1992, 25, 440.
33. Li, Y.; Hu, Z.; Li, C. J Appl Polym Sci 1993, 50, 1107.
34. Chow, T. S. J Rheol 1992, 36, 1707.
35. Monnerie, L.; Halary, J. L.; Kausch, H. H. Adv Polym Sci 2005, 187, 215.
36. Strobl, G. The Physics of Polymers, 3rd ed.; Springer: Berlin, Heidelberg, 2007.
37. Klapperich, C.; Komvopoulos, K.; Pruitt, L. J Tribol 2001, 123, 624.
38. He, J. Y.; Zhang, Z. L.; Midttun, M.; Fonnum, G.; Modahl, G. I.; Kristiansen, H.; Redford, K. Polymer 2008, 49, 3993.