Mechanical, thermal, and electrical analysis of a compliant interconnect

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 2, 2005, Pages 297-302

  Galloway, Jesse ^a   Syed, Ahmer ^a   Kang, WonJoon ^b   Kim, JinYoung ^b   Cannis, Jeff ^a   Ka, YunHyeon ^b   Kim, SeungMo ^b   Kim, TaeSeong ^b   Lee, GiSong ^b   Ryu, SangHyun ^b  

^a AMKOR TECHNOLOGY   (United States)

^b Amkor Technology Korea Inc   (South Korea)

Author keywords

Ball; Plastic; Reliability; Solder joint

Indexed keywords

COPPER; ELECTRIC RESISTANCE; FATIGUE OF MATERIALS; FRACTURE; HEAT RESISTANCE; MECHANICAL PROPERTIES; PLASTICS APPLICATIONS; RELIABILITY; SOLDERED JOINTS; THERMAL CYCLING; THERMOANALYSIS;

BALL GRID ARRAY (BGA) PACKAGE; COMPLIANT INTERCONNECT; ELECTRICAL ANALYSIS; MECHANICAL ANALYSIS; METALIZED POLYMER SPHERES (MPS); SOLDER BALLS;

ELECTRONICS PACKAGING;

EID: 21044435831     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848504     Document Type: Article

References (6)

1. B. Vandevelde, E. Beyne, J. V. Van Puymbroeck, and M. Heerman, "Thermal fatigue analysis of the flip-chip assembly on the polymer stud grid array (PSGA) package," in Proc. Electronic Components Technology Conf., 1999, pp. 823-829.
2. S. W. Yoon and J. T. Moon, "CSP board level reliability testing of Pb-free Sn-Ag-X (X = Cu, In) and polymer-core solder ball," in Proc. Tech. Program Pan Pacific Microelectron. Symp., 2001, pp. 29-37.
3. G. Aguirre and S. Movva, "High reliability second level interconnects using polymer core BGAs," in Proc. Electronic Component Technology Conf., vol. 2, 2004, pp. 1443-1448.
4. Sekisui, Inc., "Technical Data, Solder Ball Made of a Plastic Core 'Micropearl SOL'," Tech. Rep., Feb. 2001.
5. K. Brakke, "The Surface Evolver," Tech. Rep., [Online] Available: http://www.susqu.edu/facstaff/b/brakke/evolver/, 2004.
6. J. E. Sergent and K. Krum, Thermal Management Handbook for Electronic Assemblies. New York: McGraw-Hill, 1998, p. 3-10.