Characterisation of metal-coated polymer spheres and its use in anisotropic conductive adhesive

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

Volumn , Issue , 2004, Pages 259-263

  Kristiansen, H ^a,b   Gronlund T O ^a   Liu, J ^a,b  

^a Mosaic Solutions AS and Conpart AS   (Norway)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COMPRESSIVE STRENGTH; CONDUCTIVE MATERIALS; ELASTIC MODULI; ELECTRIC CONDUCTIVITY; ELECTRIC CONTACTS; ELECTRIC LOADS; ELECTRIC RESISTANCE; MECHANICAL TESTING; SCANNING ELECTRON MICROSCOPY; VISCOSITY;

ADHESIVE FLOW; ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); COMPRESSIVE LOAD; SILICON CHIPS;

ELECTRONICS PACKAGING;

EID: 14844320835     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Liu, J, Conductive Adhesives for Electronics Pack-aging. London, U.K.: Electrochemical Publications Ltd., 1999.
2. Kristiansen, H, Liu, J, "Behaviour and Properties of Conductive Particles in Anisotropic Conductive Adhesive", High Density Electronics Packaging 2002, Shanghai, July 2002
3. Ogunjimi, A O et al, "The assembly process for anisotropic conductive joints - some new experimental and theoretical results", Journal of Electronic Manu-facturing, Vol. 5:263-272, 1995
4. Whalley, D et al, "Characterisation of Anisotropic Conductive Adhesive Compression During the Assembly Process", Proc InterPack 2003, July 2003
5. Kristiansen, H, et al, "Electrical and Mechanical Properties of Metal-coated Polymer Spheres for Anisotropic Conductive Adhesive", Pro, PEP 99; Gothenburg Oct. 99, pp 63 - 71