Effect of Ni-P thickness on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 2, Issue , 2005, Pages 873-878

  Kumar, Aditya ^a   Chen, Zhong ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ELECTROLESS PLATING; FRACTURE; INTERMETALLICS; TENSILE STRENGTH;

BRITTLE FAILURE; FRACTURE SURFACES; MECHANICAL RELIABILITY;

SOLDERED JOINTS;

EID: 33847258347     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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