The development and commercialization of lead-free soldering

MRS Bulletin

Volumn 26, Issue 11, 2001, Pages 880-884

  Suganuma, Katsuaki ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001048179     PISSN: 08837694     EISSN: None     Source Type: Journal    
DOI: 10.1557/mrs2001.228     Document Type: Article

References (7)

1. Lead-Free Solder Project Final Report, NCMS Report 0401RE96 (National Center for Manufacturing Sciences, Ann Arbor, MI, 1997).
2. Lead-Free Solder Working Report on High-Bi Solders (JIEP Lead-Free Solder Working Group, Osaka, 1997).
3. M.R. Harrison and J.H. Vincent, in Proc. 12th Microelectronics and Packaging Conf. (IMAPS Europe, Cambridge, 1999) p. 8.
4. NEDO Research and Development on Lead-Free Soldering, Report No. 00-ki-17 (Japan Electronics Industry Development Association, Tokyo, 2000).
5. Project Symposium on Research and Development on Lead-Free Soldering for Standardization (Japan Welding Engineering Society, Tokyo, 2000).
6. Proc. Symp. on the Promotion of Sn-Zn Lead-Solder (Japan Institute of Electronics Packaging, Tokyo, 2001).
7. K. Suganuma, Curr. Opin. Solid State Mater. 5 (1) (2001) p. 555.