Comparison of Au and Au-Ni alloys as contact materials for MEMS switches

Journal of Microelectromechanical Systems

Volumn 18, Issue 2, 2009, Pages 287-295

  Yang, Zhenyin ^a   Lichtenwalner, Daniel J ^a   Morris III, Arthur S ^b   Krim, Jacqueline ^c   Kingon, Angus I ^a,d  

^a North Carolina State University   (United States)

^b Wispry Inc   (United States)

^c NORTH CAROLINA STATE UNIVERSITY   (United States)

^d Brown University   (United States)

Author keywords

Alloys; Au Ni alloys; Electrical contacts; Microelectromechanical systems (MEMS); Microswitch; Radiofrequency (RF) MEMS

Indexed keywords

AU-NI ALLOYS; ELECTRICAL CONTACTS; MICROELECTROMECHANICAL SYSTEMS (MEMS); MICROSWITCH; RADIOFREQUENCY (RF) MEMS;

ADHESION; ALLOYS; COMPOSITE MICROMECHANICS; CONTACT RESISTANCE; DEGRADATION; ELECTRIC CONTACTS; ELECTRIC SWITCHES; GOLD; GOLD ALLOYS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; NICKEL; NICKEL ALLOYS; PHASE SEPARATION; SURFACE TOPOGRAPHY;

SURFACES;

EID: 67349128609     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2008.2010850     Document Type: Article

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