Polishing pad surface characterisation in chemical mechanical planarisation

Journal of Materials Processing Technology

Volumn 153-154, Issue 1-3, 2004, Pages 666-673

  McGrath, John ^a   Davis, Chris ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

Bearing curve parameters; Pad surface features; Polishing pad conditioning

Indexed keywords

DEGRADATION; DENSITY (SPECIFIC GRAVITY); ELASTIC MODULI; GLAZES; PLASTIC DEFORMATION; POLISHING; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS;

BEARING CURVE PARAMETERS; CHEMICAL MECHANICAL PLANARIZATION (CMP); PAD SURFACE FEATURES; POLISHING PAD CONDITIONING;

SURFACE STRUCTURE;

EID: 9444271645     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2004.04.094     Document Type: Article

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