Cu (Re Nx) for advanced barrierless interconnects stable up to 730°C

Journal of the Electrochemical Society

Volumn 156, Issue 7, 2009, Pages

  Chu, J P ^a   Lin, C H ^b   Sun, P L ^c   Leau, W K ^d  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b CHIN MIN INSTITUTE OF TECHNOLOGY   (Taiwan)

^c FENG CHIA UNIVERSITY   (Taiwan)

^d NATIONAL TAIWAN OCEAN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CU INTERCONNECT; FILM ADHESION; FILM RESISTIVITY; ORDERS OF MAGNITUDE;

OPTICAL INTERCONNECTS; SILICON;

HEATING;

EID: 65949092772     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3122668     Document Type: Article

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