Characterization of poly(silsesquioxane) by thermal curing

Proceedings of the National Science Council, Republic of China, Part A: Physical Science and Engineering

Volumn 25, Issue 6, 2001, Pages 339-343

  Yang, C C ^a   Chen, W C ^a   Chen, L M ^a   Wang, C J ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Cage; Curing; Network; Poly(silsesquioxane); Two stage kinetics

Indexed keywords

ENERGY PRODUCTION; FILM; HYBRIDO ORGANO SILOXANE POLYMER; HYDROGEN SILSEQUIOXANE; MATERIAL FORMS AND STATES; METHYL SILSES QUIOXANE; POLY(SILSESQUIOXANE); TEMPERATURE; THERMAL CURING;

ACTIVATION ENERGY; POLYMERS; RATE CONSTANTS;

CAGE STRUCTURES;

SILICON COMPOUNDS;

POLYMER;

EID: 0035504927     PISSN: 02556588     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (14)

1. Materials issues with thin film hydrogen silsesquioxane low K dielectries
2. Thermal reactivity of hydrogenosilsesquioxane gels
3. Low-dielectric constant materials III
4. Chemical-mechanical polishing of low dielectric constant poly(silsesquioxane): HSQ
5. Effects of slurry formulations on chemical-mechanical polishing of low dielectric constant polysiloxanes: Hydridoorgano siloxane and methyl silsesquioxane
6. Chemical-mechanical polishing of low-dielectric-constant polymers: Hydrogen silsesquioxane and methyl silsesquioxane
7. Low-dielectric constant materials IV
8. In situ characterization of methyl silsesquioxane curing
9. Low-dielectric constant materials V
10. Effects of film thickness and cure temperature on the mechanical properties of fox flowable oxide thin films
11. Atomic structure impacts on dieletric and mechanical properties of hydrogen silsesquioxane during thermal curing
12. Properties of a SiOx:H thin films deposited from hydrogen silsesquioxane resins
13. Thermal curing of hydrogen silsesquioxane