Effect of 260 °C reflow on the ability of mold compounds to meet moisture sensitivity level one (MSL 1)

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 4, 2005, Pages 841-851

  Fauty, Joseph ^a   Cada, Leonorina G ^b,c   Stana, Michal ^d  

^a ON Semiconductor   (United States)

^b Intel Technology Philippines Inc   (Philippines)

^c UNIVERSITY OF THE PHILIPPINES   (Philippines)

^d MOTOROLA INC   (United States)

Author keywords

260 C reflow; Epoxy mold compound (EMC); Moisture sensitivity level (MSL); Popcorning

Indexed keywords

ADHESION; COMPUTER SIMULATION; COPPER; DELAMINATION; EPOXY RESINS; MOISTURE; PLASTIC FLOW; SENSITIVITY ANALYSIS; STRESSES; TENSILE PROPERTIES; THERMOGRAVIMETRIC ANALYSIS;

EPOXY MOLD COMPOUND (EMC); MOISTURE SENSITIVITY LEVEL ONE (MSL1); POPCORNING; SIMULATED SOLDER REFLOW;

PLASTIC MOLDS;

EID: 29244433072     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848566     Document Type: Article

References (25)

1. Joint industry standard moisture/reflow sensitivity classification for nonhermetic solid state surface mount devices, IPC/JEDEC J-STD-020A, 1999.
2. A. Gallo and R. Munamarty, "Popcorning: A Failure mechanism in plastic encapsulated microcircuits," IEEE Trans. Reliab., vol. 44, no. 9, pp. 362-367, Sep. 1995.
3. S. Omi, K. Fujita, T. Tsuda, and T. Maeda, "Causes of cracks in SMD and type specific remedies," IEEE Trans. Comp., Hybrids, Manuf. Technology, vol. 14, no. 4, pp. 818-823, Dec. 1991.
4. P. Alpern, R. Dudek, R. Schmidt, V. Wicher, and R. Tilgner, "On the mode II popcorn effect in thin packages," IEEE Trans. Compon. Packag. Technol., vol. 25, no. 5, pp. 56-65, Mar. 2002.
5. P. Alpern, K. C. Lee, R. Dudek, and R. Tilgner, "A simple model for the mode I popcorn effect for IC packages with copper leadframe," IEEE Trans. Compon. Packag. Technol., vol. 25, no. 2, pp. 301-308, Jun. 2002.
6. R. L. Shook and J. P. Goodelle, "Handling of highly-moisture sensetive components - An analysis of low-humidity containment and baking schedules," IEEE Trans. Electron. Packag. Manuf., vol. 23, no. 4, pp. 81-86, Apr. 2000.
7. R. L. Shook, T. R. Conrad, V. S. Sastry, and D. B. Steele, "Diffusion model to derate moisture sensitive surface mount IC's for factory use conditions," IEEE Trans. Compon., Packag. Manuf. Technol. C, vol. 19, no. 2, pp. 110-118, Apr. 1996.
8. L. L. Mercado and B. Chavez, "Impact of JEDEC test conditions on new-generation package reliability," IEEE Trans. Compon. Packag. Technol., vol. 25, no. 2, pp. 204-210, Jun. 2002.
9. Y. E. Huang, D. Hagen, G. Dody, and T. Burnette, "How reflow temperatures affect BGA delamination," Surface Mount Technol., pp. 154-57, Feb. 1999.
10. P. McCluskey, R. Munamarty, and M. Pecht, "Popcorning in PBGA packages during IR reflow soldering," Microelectron. Int., no. 42, pp. 20-23, Jan. 1997.
11. B. Love and P. Packman, "Effects of surface modifications on the peel strength of copper based polymer/metal interfaces with characteristic morphologies," J. Adhesion, vol. 40, pp. 139-150, 1993.
12. J.-K. Kim, M. Lebbai, J. H. Liu, J. H. Kim, and M. Yuen, "Interface adhesion between copper lead frame and epoxy molding compound: Effects of surface finish, oxidation and dimples," in Proc. 50th Electronic Components and Technology Conf., 2000, pp. 601-608.
13. D. S. Chun and D. A. Doane, "Reduction of popcorning in BGAs by plasma cleaning," in Proc. 2nd Pan Pacific Microelectronics Symp., Jan. 1997.
14. S. Kim, "The role of plastic package adhesion in performance," IEEE Trans. Comp., Hybrids, Manuf. Technol., vol. 14, no. 4, pp. 809-817, Dec. 1991.
15. T. Thompson and R. Kohn, "Implementation of cost effective, level 1, delamination and crack-free solutions for QFPs," in Proc. Int. Electronics Packaging Conf., Austin, TX, Sep. 1996, pp. 468-474.
16. D. Hagen, S. downey, C. Hughes, G. Fowkes, M. L. Lim, K. Anuar, and R. Ibrahim, "JEDEC level 1 moisture performance solution for 20 × 20 × 1.4 mm TQFPs," in Proc. Int. Electronics Packaging Conf., Austin, TX, Sep. 1996, pp. 102-111.
17. K. Tada and H. Fujioka, "Properties of molding compounds to improve package reliability of SMD's," IEEE Trans. Compon. Packag. Technol., vol. 22, no. 4, pp. 534-540, Dec. 1999.
18. A. Gallo and T. R. Tubbs, "High solder-reflow crack resistant molding compound," IEEE Trans. Compon., Packag. Manuf. Technol. A, vol. 18, no. 3, pp. 646-649, Sep. 1995.
19. T. O. Steiner and D. Suhl, "Investigations of large PLCC package cracking during surface mount exposure," IEEE Trans. Comp., Hybrids, Manuf. Technol., vol. 10, no. 2, pp. 209-216, Jun. 1987.
20. H. Lee and Y. Y. Earmme, "A fracture mechanics analysis of the effects of material properties and geometries of components on various types of package cracks," IEEE Trans. Compon., Packag., Manuf. Technol. A, vol. 19, no. 2, pp. 168-178, Jun. 1996.
21. A. A. O. Tay, G. L. Tan, and T. B. Lim, "Predicting delamination in plastic IC packages and determining suitable mold compound properties," IEEE Trans. Compon., Packag., Manuf. Technol. B, vol. 17, no. 2, pp. 201-208, May 1994.
22. G. S. Ganesan and H. M. Berg, "Model and analysis for solder reflow cracking phenomena in SMT plastic packages," IEEE Trans. Comp., Hybrids, Manuf. Technol., vol. 16, no. 8, pp. 940-948, Dec. 1993.
23. J. Sauber, L. Lee, S. Hsu, and T. Hongsmatip, "Fracture properties of molding compound materials for IC plastic packaging," IEEE Trans. Comp., Hybrids, Manuf. Technol. A, vol. 17, no. 4, pp. 533-541, Dec. 1994.
24. S. Lui and Y. H. Mei, "An investigation to popcorning mechanisms for IC plastic packages: EMC cracking," Int. J. Microcircuits Electron. Packag., vol. 20, no. 3, pp. 431-445, 1997.
25. E. Takano, T. Mino, K. Takahashi, K. Sawada, S. Shimizu, and H. Y. Yoo, "The oxidation control of copper lead frame package for prevention of popcorn cracking," in Proc. IEEE 47th Electronic Components and Technology Conf., 1997, pp. 78-83.