Reliability assessment of a high CBGA for high availability systems

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 611-616

  Teng, Sue Y ^a   Brillhart, Mark ^a  

^a CISCO SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; CERAMIC MATERIALS; FINITE ELEMENT METHOD; FRACTURE MECHANICS; PRINTED CIRCUIT BOARDS; ROUTERS; SOLDERED JOINTS; SWITCHES; THERMAL EXPANSION; THERMAL LOAD;

CERAMIC BALL GRID ARRAY (CBGA) PACKAGES;

ELECTRONICS PACKAGING;

EID: 0036297120     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy
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3. Chip Scale Package (CSP) solder joint reliability and modeling
4. Reliability of plastic ball grid array assembly
5. FEA reliability assessment methodology investigation to improve prediction accuracy
6. Implementations of and extensions to Darveaux's approach to finite element simulation of BGA solder joint reliability
7. Board level solder joint reliability modeling of LFBGA package
8. Reliability of controlled collapse interconnections
9. Component-to-PWB reliability