A Mössbauer study of tin-based intermetallics formed during the manufacture of dispersion-strengthened composite solders

Journal of Electronic Materials

Volumn 26, Issue 1, 1997, Pages 11-15

  Reno, Robert C ^a   Panunto, Michael J ^a   Piekarski, Brett H ^b  

^a UNIVERSITY OF MARYLAND BALTIMORE COUNTY   (United States)

^b U S ARMY RESEARCH LABORATORY   (United States)

Author keywords

Dispersion strengthening; Intermetallics; M ssbauer spectroscopy; Solder

Indexed keywords

EID: 5844381979     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-997-0125-5     Document Type: Article

References (12)

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