Application of Through Mold Via (TMV) as PoP base package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1089-1092

  Kim, Jinseong ^a   Lee, Kiwook ^a   Park, Dongjoo ^a   Hwang, Taekyung ^a   Kim, Kwangho ^a   Kang, Daebyoung ^a   Kim, Jaedong ^a   Lee, Choonheung ^a   Scanlan, Christopher ^b   Berry, C J ^b   Zwenger, Curtis ^b   Smith, Lee ^b   Dreiza, Moody ^b   Darveaux, Robert ^b  

^a Amkor Technology Korea Inc   (South Korea)

^b AMKOR TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC COMPONENTS; MEMORY INTERFACES; MULTIMEDIA DEVICES; WARPAGE CONTROL;

APPLICATIONS; MOLDS;

MULTIMEDIA SYSTEMS;

EID: 51349144888     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550110     Document Type: Conference Paper

References (5)

1. Yoshida, Akito et al., "A Study on Package Stacking Process for Package-on-Package (PoP)" ECTC, SanDiego (2006)
2. Dreiza, Moody et al., "Stacked Package-on-Package Design Guidelines", International Wafer Level Packaging conference (2005)
3. JEDEC JC-11 committee Publication 95, Design Guide 4.22, Item: 11.02-726S
4. JEDEC JESD 22-A104C Temperature Cycling
5. JEDEC JESD22-B111 Board Level Drop Test Method of Components for Handheld Electronic Products