Through silicon vias technology for CMOS image sensors packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 556-562

  Henry, D ^a   Jacquet, F ^a   Neyret, M ^a   Baillin, X ^a   Enot, T ^a   Lapras, V ^a   Brunet Manquat, C ^a   Charbonnier, J ^a   Aventurier, B ^a   Sillon, N ^a  

^a CEA LETI   (France)

Author keywords

Advanced packaging; CMOS Image Sensors (CIS); Through Silicon Vias (TSV); Wafer level technologies

Indexed keywords

CHIP SCALE PACKAGES; COMPUTER NETWORKS; DIGITAL CAMERAS; DIGITAL IMAGE STORAGE; ELECTRONIC EQUIPMENT MANUFACTURE; GLASS BONDING; IMAGE SENSORS; LITHOGRAPHY; NONMETALS; PIXELS; SEMICONDUCTING SILICON COMPOUNDS; SENSORS; SILICON; SILICON WAFERS; WAFER BONDING;

ADVANCED PACKAGING; CMOS IMAGE SENSORS (CIS); ELECTRONIC COMPONENTS; THROUGH SILICON VIAS (TSV); WAFER LEVEL TECHNOLOGIES;

ELECTRONICS PACKAGING;

EID: 51349165487     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550028     Document Type: Conference Paper

References (8)

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