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Volumn 5, Issue 1, 2009, Pages 56-66

A Neurofuzzy method for the evaluation of soldering global quality index

Author keywords

Neurofuzzy system; Printed circuit boards (PCB); Solder printing; Soldering assessment; Surface mount technology (SMT)

Indexed keywords

BRAZING; CONTROL SYSTEM ANALYSIS; ELECTROMAGNETIC WAVE EMISSION; FUZZY NEURAL NETWORKS; INTEGRATED CIRCUITS; MOUNTINGS; OPTICAL SYSTEMS; PRINTED CIRCUIT MANUFACTURE; PRINTING; PRODUCTION ENGINEERING; QUALITY CONTROL; SURFACE MOUNT TECHNOLOGY; WELDING;

EID: 62449140641     PISSN: 15513203     EISSN: None     Source Type: Journal    
DOI: 10.1109/TII.2008.2008640     Document Type: Article
Times cited : (29)

References (27)
  • 1
    • 33644792086 scopus 로고    scopus 로고
    • Detection of flip chip solder joint cracks using correlation coefficient and auto-comparison analyses of laser ultrasound signals
    • Mar
    • L. Zhang, I. C. Ume, J. Gamalski, and K.-P. Galuschki, "Detection of flip chip solder joint cracks using correlation coefficient and auto-comparison analyses of laser ultrasound signals," IEEE Trans. Compon. Packag. Technol., vol. 29, no. 1, pp. 13-19, Mar. 2006.
    • (2006) IEEE Trans. Compon. Packag. Technol , vol.29 , Issue.1 , pp. 13-19
    • Zhang, L.1    Ume, I.C.2    Gamalski, J.3    Galuschki, K.-P.4
  • 2
    • 35348820607 scopus 로고    scopus 로고
    • Automated solder inspection technique for BGA-mounted substrates by means of oblique computed tomography
    • Oct
    • A. Teramoto, T. Murakoshi, M. Tsuzaka, and H. Fujita, "Automated solder inspection technique for BGA-mounted substrates by means of oblique computed tomography," IEEE Trans. Electron. Packag. Manuf., vol. 30, no. 4, pp. 285-292, Oct. 2007.
    • (2007) IEEE Trans. Electron. Packag. Manuf , vol.30 , Issue.4 , pp. 285-292
    • Teramoto, A.1    Murakoshi, T.2    Tsuzaka, M.3    Fujita, H.4
  • 3
    • 10444282838 scopus 로고    scopus 로고
    • Detection of flip chip solder bump with wavelet analysis of laser ultrasound
    • Orlando, FL, June 1-4
    • L. Zhang, I. C. Ume, J. Gamalski, and K.-P. Galuschki, "Detection of flip chip solder bump with wavelet analysis of laser ultrasound," in Proc. Electronic Components and Technology Conf., Orlando, FL, June 1-4, 2004, vol. 1, pp. 113-119.
    • (2004) Proc. Electronic Components and Technology Conf , vol.1 , pp. 113-119
    • Zhang, L.1    Ume, I.C.2    Gamalski, J.3    Galuschki, K.-P.4
  • 4
    • 33750034192 scopus 로고    scopus 로고
    • Effectiveness study of an automated 3D laminography X-ray inspection system in a high volume-Low-Mix SMT line
    • Oct
    • P. Manjeshwar, J. Craik, S. Phadnis, and K. Srihari, "Effectiveness study of an automated 3D laminography X-ray inspection system in a high volume-Low-Mix SMT line," Int. J. Adv. Manuf. Technol., vol. 30, no. 11-12, pp. 1191-1201, Oct. 2006.
    • (2006) Int. J. Adv. Manuf. Technol , vol.30 , Issue.11-12 , pp. 1191-1201
    • Manjeshwar, P.1    Craik, J.2    Phadnis, S.3    Srihari, K.4
  • 5
    • 0039563536 scopus 로고    scopus 로고
    • The effect of solder paste volume and reflow ambient atmosphere on reliability of CBGA assemblies
    • Y. P. Wu, P. L. Tu, and Y. C. Chan, "The effect of solder paste volume and reflow ambient atmosphere on reliability of CBGA assemblies," J Electron. Packag., vol. 123, pp. 284-289, 2001.
    • (2001) J Electron. Packag , vol.123 , pp. 284-289
    • Wu, Y.P.1    Tu, P.L.2    Chan, Y.C.3
  • 6
    • 32144464590 scopus 로고    scopus 로고
    • 2-D and 3-D inspections catch solder-paste problems
    • M. Owen, "2-D and 3-D inspections catch solder-paste problems," Test Meas. World, vol. 20, pp. 13-18, 2000.
    • (2000) Test Meas. World , vol.20 , pp. 13-18
    • Owen, M.1
  • 7
    • 38049025230 scopus 로고    scopus 로고
    • Reconstruction of solder joint surface based on shape from shading
    • Haikou, China, Aug. 24-27
    • F.-H. Kong and Y.-X. Wang, "Reconstruction of solder joint surface based on shape from shading," in Proc. 3rd Int. Conf. Natural Computation ICNC 2007, Haikou, China, Aug. 24-27, 2007, vol. 5, pp. 58-62.
    • (2007) Proc. 3rd Int. Conf. Natural Computation ICNC 2007 , vol.5 , pp. 58-62
    • Kong, F.-H.1    Wang, Y.-X.2
  • 8
    • 32144439026 scopus 로고    scopus 로고
    • Full-field 3-D measurement of solder pastes using LCD-based phase shifting techniques
    • Jan
    • H.-N. Yen, D.-M. Tsai, and J.-Y. Yang, "Full-field 3-D measurement of solder pastes using LCD-based phase shifting techniques," IEEE Trans. Electron. Packag. Manuf, vol. 29, no. 1, pp. 50-57, Jan. 2006.
    • (2006) IEEE Trans. Electron. Packag. Manuf , vol.29 , Issue.1 , pp. 50-57
    • Yen, H.-N.1    Tsai, D.-M.2    Yang, J.-Y.3
  • 9
    • 33845580310 scopus 로고    scopus 로고
    • Defect detection of flip chip solder bump with wavelet analysis of laser ultrasound signals
    • San Diego, CA, May 30-June 2
    • J. Yang, L. Zhang, and I. C. Ume, "Defect detection of flip chip solder bump with wavelet analysis of laser ultrasound signals," in Proc. 56th Electronic Components and Technology Conf., San Diego, CA, May 30-June 2, 2006, pp. 614-620.
    • (2006) Proc. 56th Electronic Components and Technology Conf , pp. 614-620
    • Yang, J.1    Zhang, L.2    Ume, I.C.3
  • 10
    • 33747388531 scopus 로고    scopus 로고
    • Fuzzy interference filter and morphological operators for short circuits detection in printed circuit board
    • L'Aquila, Italy, Jul. 8-11
    • F. Voci, S. Eiho, and N. Sugimoto, "Fuzzy interference filter and morphological operators for short circuits detection in printed circuit board," in Proc. Int. Symp. Industrial Electronics, L'Aquila, Italy, Jul. 8-11, 2002, vol. 2, pp. 672-677.
    • (2002) Proc. Int. Symp. Industrial Electronics , vol.2 , pp. 672-677
    • Voci, F.1    Eiho, S.2    Sugimoto, N.3
  • 11
    • 0036500759 scopus 로고    scopus 로고
    • Optimizing printer-based solder paste inspection
    • J. Morini, J. Cronin, and O. O'Neal, "Optimizing printer-based solder paste inspection," Circuits Assemb., vol. 13, pp. 32-37, 2002.
    • (2002) Circuits Assemb , vol.13 , pp. 32-37
    • Morini, J.1    Cronin, J.2    O'Neal, O.3
  • 12
    • 0033116105 scopus 로고    scopus 로고
    • Visual inspection system for the classification of solder joints
    • T. H. Kim, T. H. Cho, Y. S. Moon, and S. H. Park, "Visual inspection system for the classification of solder joints," Pattern Recognit., pp. 565-575, 1999.
    • (1999) Pattern Recognit , pp. 565-575
    • Kim, T.H.1    Cho, T.H.2    Moon, Y.S.3    Park, S.H.4
  • 13
    • 18844392149 scopus 로고    scopus 로고
    • Support vector machine-based inspection of solder joints using circular illumination
    • May
    • T. S. Yun, K. J. Sim, and H. J. Kim, "Support vector machine-based inspection of solder joints using circular illumination," Electron. Lett., vol. 36, no. 11, pp. 949-951, May 2000.
    • (2000) Electron. Lett , vol.36 , Issue.11 , pp. 949-951
    • Yun, T.S.1    Sim, K.J.2    Kim, H.J.3
  • 14
    • 0034171750 scopus 로고    scopus 로고
    • Solder joint inspection using a neural network and fuzzy rule-based classification method
    • Oct
    • K. W. Ko and H. S. Cho, "Solder joint inspection using a neural network and fuzzy rule-based classification method," IEEE Trans. Electron. Packag. Manuf., vol. 23, no. 2, pp. 93-103, Oct. 1998.
    • (1998) IEEE Trans. Electron. Packag. Manuf , vol.23 , Issue.2 , pp. 93-103
    • Ko, K.W.1    Cho, H.S.2
  • 15
    • 32144439026 scopus 로고    scopus 로고
    • Full-field 3-D measurement of solder pastes using LCD-based phase shifting techniques
    • Jan
    • H. N. Yen, D. M. Tsai, and J. Y. Yang, "Full-field 3-D measurement of solder pastes using LCD-based phase shifting techniques," IEEE Trans. Electron. Packag. Manuf., vol. 29, no. 1, pp. 50-57, Jan. 2006.
    • (2006) IEEE Trans. Electron. Packag. Manuf , vol.29 , Issue.1 , pp. 50-57
    • Yen, H.N.1    Tsai, D.M.2    Yang, J.Y.3
  • 16
    • 0031097282 scopus 로고    scopus 로고
    • A neural network approach to extended Gaussian image based solder joint inspection
    • Y. K. Ryu and H. S. Cho, "A neural network approach to extended Gaussian image based solder joint inspection," Mechatronics, vol. 7, no. 2, pp. 159-184, 1997.
    • (1997) Mechatronics , vol.7 , Issue.2 , pp. 159-184
    • Ryu, Y.K.1    Cho, H.S.2
  • 17
    • 0012844729 scopus 로고    scopus 로고
    • Automatic inspection of wave soldered joints using neural networks
    • S. Jagannathan, "Automatic inspection of wave soldered joints using neural networks," J. Manuf. Syst., vol. 16, no. 6, pp. 389-398, 1997.
    • (1997) J. Manuf. Syst , vol.16 , Issue.6 , pp. 389-398
    • Jagannathan, S.1
  • 18
    • 0027887141 scopus 로고
    • Improving X-ray inspection of printed circuits boards by integration of neural network classifiers
    • Santa Clara, CA, Oct. 4-6
    • C. Neubauer and R. Hanke, "Improving X-ray inspection of printed circuits boards by integration of neural network classifiers," in Proc. Electronic Manufacturing Technology Symp., Santa Clara, CA, Oct. 4-6, 1993, pp. 14-18.
    • (1993) Proc. Electronic Manufacturing Technology Symp , pp. 14-18
    • Neubauer, C.1    Hanke, R.2
  • 19
    • 0033681937 scopus 로고    scopus 로고
    • A neural network approach to the inspection of ball grid array solder joints on printed circuit boards
    • Como, Italy, Jul. 24-27
    • K. W. Ko, Y. J. Roh, H. S. Cho, and H. C. Kim, "A neural network approach to the inspection of ball grid array solder joints on printed circuit boards," in Proc. Int. Joint Conf. Neural Network, Como, Italy, Jul. 24-27, 2000, vol. 5, pp. 233-238.
    • (2000) Proc. Int. Joint Conf. Neural Network , vol.5 , pp. 233-238
    • Ko, K.W.1    Roh, Y.J.2    Cho, H.S.3    Kim, H.C.4
  • 20
    • 33747407368 scopus 로고    scopus 로고
    • Application of neural networks in optical inspection and classification of solder joints in surface mount technology
    • Aug
    • G. Acciani, G. Brunetti, and G. Fornarelli, "Application of neural networks in optical inspection and classification of solder joints in surface mount technology," IEEE Trans. Ind. Informal., vol. 2, no. 3, pp. 200-209, Aug. 2006.
    • (2006) IEEE Trans. Ind. Informal , vol.2 , Issue.3 , pp. 200-209
    • Acciani, G.1    Brunetti, G.2    Fornarelli, G.3
  • 22
    • 0035386357 scopus 로고    scopus 로고
    • Wavelet-based processing of ECT images for inspection of printed circuit board
    • Jul
    • T. Taniguchi, D. Kacprzak, S. Yamada, and M. lwahara, "Wavelet-based processing of ECT images for inspection of printed circuit board," IEEE Trans. Magn., vol. 37, no. 4, pp. 2790-2793, Jul. 2001.
    • (2001) IEEE Trans. Magn , vol.37 , Issue.4 , pp. 2790-2793
    • Taniguchi, T.1    Kacprzak, D.2    Yamada, S.3    lwahara, M.4
  • 23
    • 0032633198 scopus 로고    scopus 로고
    • Competitive neural network scheme for learning vector quantization
    • Apr. 99
    • J. H. Wang and C. Y. Peng, "Competitive neural network scheme for learning vector quantization," Electron. Lett., vol. 35, no. 9, pp. 725-726, Apr. 99.
    • Electron. Lett , vol.35 , Issue.9 , pp. 725-726
    • Wang, J.H.1    Peng, C.Y.2
  • 24
    • 0027266182 scopus 로고
    • Functional equivalence between radial basis function network and fuzzy inference systems
    • Feb
    • J. R. Jang and C. T. Sun, "Functional equivalence between radial basis function network and fuzzy inference systems," IEEE Trans. Neural Netw., vol. 4, no. 1, pp. 156-159, Feb. 1993.
    • (1993) IEEE Trans. Neural Netw , vol.4 , Issue.1 , pp. 156-159
    • Jang, J.R.1    Sun, C.T.2
  • 25
    • 0034746283 scopus 로고    scopus 로고
    • A comparison between neural networks and decision trees based on data from industrial radiographic testing
    • Jan
    • P. Perner, U. Zscherpel, and C. Jacobsen, "A comparison between neural networks and decision trees based on data from industrial radiographic testing," Pattern Recognit. Lett., vol. 22, no. 1, pp. 47-54, Jan. 2001.
    • (2001) Pattern Recognit. Lett , vol.22 , Issue.1 , pp. 47-54
    • Perner, P.1    Zscherpel, U.2    Jacobsen, C.3
  • 27
    • 0035478854 scopus 로고    scopus 로고
    • Decision tree forests
    • Oct
    • L. Breiman, "Decision tree forests," Mach. Learn., vol. 45, no. 1, pp. 5-32, Oct. 2001.
    • (2001) Mach. Learn , vol.45 , Issue.1 , pp. 5-32
    • Breiman, L.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.