Detection of flip chip solder joint cracks using Correlation Coefficient analysis of laser ultrasound signals

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2004, Pages 113-119

  Zhang, Lizheng ^a   Ume, I Charles ^a   Gamalski, Juergen ^b   Galuschki, Klaus Peter ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BROADBAND ULTRASONIC WAVES; SIGNAL BANDWIDTH; SOLDER REFLOW;

BANDWIDTH; CORRELATION METHODS; CRACKS; ELECTRONICS PACKAGING; NEODYMIUM LASERS; SIGNAL PROCESSING; SIGNAL TO NOISE RATIO; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY;

FLIP CHIP DEVICES;

EID: 10444282838     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Beddingfleld, C., "Flip Chip Process Challenges for SMT Assembly," Electronic Packaging & Production, Mar. 2003.
2. Gudat, J., "Selection Criteria for X-ray Inspection Systems for BGA and CSP Solder Joint Analysis," Contract Electronics Manufacturers Conference and Exhibition (CEMCEX) 2003, Gyor, Hungary, Sep. 2003.
3. Liu, S., Erdahl, D., Ume, C., Achari, A. and Gamalski, J., "A Novel Approach for Flip Chip Solder Joint Quality Inspection: Laser Ultrasound and Interferometric System," IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 4 (2001), pp. 616-624.
4. Liu, S., Ume, C., Achari, A. and Gamalski, J., "Capabilities of Flip Chip Defects Instpection Method by Using Laser Techniques," The International Journal of Microcircuits & Electronics Packaging, Vol. 24, No. 2, pp. 122-131
5. Howard, T., Erdahl, D., Ume, C. and Galmaski, J., "Development of an Advanced System for Inspection of Flip Chip and Chip Scale Packaging Interconnects using Laser Ultrasound and Interferometric Techniques", The International Journal of Microcircuits & Electronic Packaging, Vol. 25, No. 1, pp. 1-14.
6. Liu, S. and Ume, C., "Vibration Analysis Based Modeling and Defect Recognition for Flip Chip Solder Joint Inspection," ASME Journal of Electronics Packaging, Vol. 124, pp. 221-226.
7. Liu, S. and Ume, C., "Digital Signal Processing in A Novel Flip Chip Solder Joint Defects Inspection System," ASME Journal of Electronics Packaging, Vol. 125, pp. 39-43
8. Liu, S.; Ume, C. and Achari, A., "Defects Pattern Recognition for Flip Chip Solder Joint Quality Inspection with Laser Ultrasound and Interferometer", in press, IEEE Transactions on Electronics Packaging Manufacturing, 2004.
9. Martin, P. L., Electronic Failure Analysis Handbook, McGraw-Hill (1999), pp. 13.39.
10. Dixon, S. et al, "Ultrasound Generation in Single-Crystal Silicon Using a Pulsed Nd:YAG Laser," Journal of Physics, D, Applied Physics 29 (1996): 1345.