Full-field 3-D measurement of solder pastes using LCD-based phase shifting techniques

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 29, Issue 1, 2006, Pages 50-57

  Yen, Hsu Nan ^a   Tsai, Du Ming ^b   Yang, Jun Yi ^b,c  

^a ST JOHN'S UNIVERSITY   (Taiwan)

^b YUAN ZE UNIVERSITY   (Taiwan)

^c NATIONAL TAIWAN NORMAL UNIVERSITY   (Taiwan)

Author keywords

Phase shifting technique; Printing quality inspection; Solder paste volume; Three dimensional (3 D) measurement

Indexed keywords

LIQUID CRYSTAL DISPLAYS; MEASUREMENT ERRORS; PHASE SHIFT; PRINTED CIRCUIT MANUFACTURE; SOLDERED JOINTS; SOLDERING ALLOYS; VOLUME MEASUREMENT;

PRINTING QUALITY INSPECTION; SOLDER PASTES; VOLUME MEASUREMENT REPEATABILITY;

SURFACE MOUNT TECHNOLOGY;

EID: 32144439026     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.862632     Document Type: Article

References (29)

1. I. Fidan, R. P. Kraft, L. E. Ruff, and S. J. Derby, "Designed experiments to investigate the solder joint quality output of a prototype automated surface mount replacement system," IEEE Trans. Compon., Packag., Manuf. Technol. C, vol. 21, no. 3, pp. 172-181, Jul. 1998.
2. D. He, N. N. Ekere, and M. A. Currie, "The behavior of solder pastes in stencil printing with vibrating squeegee," IEEE Trans. Compon., Packag., Manuf. Technol. C, vol. 21, no. 4, pp. 317-324, Oct. 1998.
3. S. C. Richard, "The complete solder paste printing processes," Surface Mount Technol., vol. 13, pp. 6-8, 1999.
4. J. Pan, G. L. Tonkay, R. H. Storer, R. M. Sallade, and D. J. Leandri, "Critical variables of solder paste stencil printing for micro-BGA and fine pitch QFP," in Proc. IEEE/CPMT Int. Electron. Manuf. Technol. Symp., 1999, pp. 94-101.
5. D. W. Capson and S. K. Eng, "A tiered-color illumination approach for machine inspection of solder joints," IEEE Trans. Pattern Anal. Mach. Intell., vol. 10, no. 3, pp. 387-393, May 1988.
6. K. W. Ko, H. S. Cho, J. H. Kim, and J. S. Kim, "Solder joints inspection using neural network and fuzzy rule-based classification," in Proc. IEEE/RSJ Int. Conf. Intelligent Robots and Systems, Victoria, B.C., Canada, Oct. 1998, pp. 1565-1570.
7. T. H. Kim, T. H. Cho, Y. S. Moon, and S. H. Park, "Automatic inspection of solder joints using layered illumination," in IEEE Int. Conf. Image Processing, vol. 2, Sep. 16-19, 1996, pp. 645-648.
8. J. Morini, J. Cronin, and O. O'Neal, "Optimizing printer-based solder paste inspection," Circuits Assembly, vol. 13, pp. 32-37, 2002.
9. M. Owen, "2-D and 3-D inspections catch solder-paste problems," Test Meas. World, vol. 20, pp. 13-18, 2000.
10. Y. P. Wu, P. L. Tu, and Y. C. Chan, "The effect of solder paste volume and reflow ambient atmosphere on reliability of CBGA assemblies," J. Electron. Packag., vol. 123, pp. 284-289, 2001.
11. R. R. J. Lathrop, "Solder paste print qualification using laser triangulation," IEEE Trans. Comport., Packag., Manuf. Technol., vol. 20, pp. 174-182, 1997.
12. T. Okura, M. Kanai, S. Ogata, T. Takei, and H. Takakusagi, "Optimization of solder paste printability with laser inspection technique," in Proc. IEEE/CPMT Int. Electronics Manufacturing Technology Symp., 1997, pp. 361-365.
13. E. H. Rideout, "Lowering test costs with 3-D solder-joint inspection," Test Meas. World, vol. 10, pp. 744-1657, 1990.
14. Y. K. Ryu and H. S. Cho, "New optical measuring system for solder joint inspection," Opt. Lasers Eng., vol. 26, pp. 487-514, 1997.
15. H. Tsukahara, Y. Nishiyama, F. Takahashi, T. Fuse, M. Ando, and T. Nishino, "High-speed 3-D inspection system for solder bumps," Proc. SPIE, vol. 2597, pp. 168-177, 1995.
16. J. L. Horijon, W. D. Amstel, F. C. Couweleer, and W. C. Ligthart, "Optical system of an industrial 3-D laser scanner for solder paste inspection," Proc. SPIE, vol. 2599, pp. 162-170, 1995.
17. S. Tang and Y. Y. Hung, "Fast profilometer for the automatic measurement of 3-D object shapes," Appl. Opt., vol. 29, pp. 3012-3018, 1990.
18. X. Y. Su, W. S. Zhou, G. V. Bally, and D. Vukicevic, "Automated phase-measuring profilometry using defocused projection of a Ronchi grating," Opt. Commun., vol. 94, pp. 561-573, 1992.
19. H. Zhao, W. Chen, and Y. Tan, "Phase-unwrapping algorithm for the measurement of three-dimensional object shapes," Appl. Opt., vol. 33, pp. 4497-4500, 1994.
20. V. Srinivasan, H. C. Liu, and M. Halioua, "Automated phase-measuring profilometry of 3-D diffuse objects," Appl. Opt., vol. 23, pp. 3105-3108, 1984.
21. S. Toyooka and Y. Iwaasa, "Automatic profilometry of 3-D diffuse objects by spatial phase detection," Appl. Opt., vol. 25, pp. 1630-1633, 1986.
22. G. Mauvoisin, F. Bremand, and A. Lagarde, "Three-dimensional shape reconstruction by phase shifting shadow moiré," Appl. Opt., vol. 33, pp. 2163-2169, 1994.
23. B. V. Dorrio and J. L. Fernandez, "Phase-evaluation methods in whole-field optical measurement techniques," Meas. Sci., vol. 10, pp. 33-55, 1999.
24. V. Srinivasan, H. C. Liu, and M. Halioua, "Automated phase-measuring profilometry: A phase mapping approach," Appl. Opt., vol. 24, pp. 185-188, 1985.
25. T. Xian and X. Su, "Area modulation grating for sinusoidal structure illumination on phase-measuring profilometry," Appl. Opt., vol. 40, pp. 1201-1206, 2001.
26. J. E. Greivenkamp and J. H. Bruning, "Phase shifting interferometry," in Optical Shop Testing, D. Malacara, Ed. New York: Wiley, 1992.
27. F. Docchio, G. Sansoni, and N. Viviani, "Light-induced transmission changes in liquid crystal displays for adaptive pattern projection," IEEE Trans. Instrum. Meas., vol. 41, no. 5, pp. 629-632, Oct. 1992.
28. A. Asundi and W. Zhou, "Unified calibration technique and its applications in optical triangular profilometry," Appl. Opt., vol. 38, pp. 3556-3561, 1999.
29. Y. R. Shiau and B. C. Jiang, "Determine a vision system's 3-D coordinate measurement capability using Taguchi methods," Int. J. Prod. Res., vol. 29, pp. 1101-1122, 1991.