Optimizing printer-based solder paste inspection

Circuits Assembly

Volumn 13, Issue 3, 2002, Pages 32-37

  Morini, John ^a   Cronin, John ^a   O'Neal, Dennis ^a  

^a Speedline/MPM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; INSPECTION; PRINTED CIRCUIT BOARDS; PROCESS ENGINEERING; PRODUCTION CONTROL; SOLDERED JOINTS; STATISTICAL PROCESS CONTROL;

SOLDER PASTES;

SOLDERING ALLOYS;

EID: 0036500759     PISSN: 10540407     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)