Defect detection of flip chip solder bump with wavelet analysis of laser ultrasound signals

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 614-620

  Yang, Jin ^a   Zhang, Lizheng ^a   Ume, I Charles ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION COEFFICIENT; DEFECT DETECTION; FLIP CHIP SOLDER BUMP; LASER ULTRASOUND SIGNALS;

CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; ERROR ANALYSIS; INTERFEROMETERS; LASERS; ONLINE SYSTEMS; REAL TIME SYSTEMS; SIGNAL PROCESSING; SOLDERED JOINTS; ULTRASONICS; WAVELET TRANSFORMS;

FLIP CHIP DEVICES;

EID: 33845580310     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645713     Document Type: Conference Paper

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