The effect of solder paste volume and reflow ambient atmosphere on reliability of CBGA assemblies

Journal of Electronic Packaging

Volumn 123, Issue 3, 2001, Pages 284-289

  Wu, Y P ^a   Tu, P L ^a   Chan, Yan C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039563536     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1371782     Document Type: Article

References (9)

1. Lau, J. H., and Pao, Y., eds., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY.
2. Lau, J. H., 1995, "Solder Joint Reliability of Flip Chip and Plastic Ball Grid Array Assemblies Under Thermal, Mechanical, and Vibration Conditions," Proceedings of Japan International Electronic Manufacturing Technology Symposium, Dec., pp. 13-19.
3. Wu, Y. P., Chan, Y. C., and Lai, J. K. L., 1998, "Reliability Studies of Plastic Ball Grid Array Assemblies Reflowed in Nitrogen Ambient," Proceedings of 48th ECTC Conference, Seattle, USA, May, pp. 292-296.
4. Mescher, P., and Phelan, G., 1993, "A Practical Comparison of Surface Mount Assembly for Ball Grid Array Components," Journal of Surface Mount Technology, 8, Issue 2, pp. 24-29.
5. Hsiao, H., Lin, J. R., Chang, E. K., and Adams, S. M., 1998, "Reduction of Solder Defects Under Nitrogen," Surface Mount Technology, 12. No. 1, Jan., pp. 56-58.
6. Li, Y., Mahajan, R. L., and Subbarayan, G., 1998, "The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints," ASME J. Electron. Packag., 120, pp. 54-60.
7. Renken, F. P., and Subbarayan, G., 1998, "A Two-Body Formulation for Solder Joint Shape Prediction," ASME J. Electron. Packag., 120, pp. 302-308.
8. Coffin, L. F., 1954, "A Study of Cyclic Thermal Stresses in a Ductile Metal," Trans. ASME, 76, p. 931.
9. Lau, J. H., 1993. Thermal Stress and Strain in Microelectronics Packaging, Van Nostrand Reinhold, New York, pp. 173-222.