Fabrication of copper-based microchannel devices and analysis of their flow and heat transfer characteristics

Journal of Micromechanics and Microengineering

Volumn 19, Issue 3, 2009, Pages

  Mei, Fanghua ^a   Phillips, W A ^a   Lu, B ^a   Meng, W J ^a   Guo, S ^a  

^a LOUISIANA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ENERGY EFFICIENCY; FABRICATION; HEAT TRANSFER; METAL RECOVERY; MICROCHANNELS; SURFACE ROUGHNESS; WIRELESS TELECOMMUNICATION SYSTEMS;

AVERAGE RATES; COPPER-BASED; CU-BASED; ENCLOSED MICROCHANNELS; ENERGY-EFFICIENT LIGHTINGS; ENTRANCE LENGTHS; FLOW AND HEAT TRANSFERS; HIGH ASPECT RATIOS; HIGH HEAT FLUX REMOVALS; MACRO-SCALE; METAL-BASED MICROCHANNEL HEAT EXCHANGERS; METALLIC MOLDS; MICRO-CHANNEL DEVICES; MICROSCALE STRUCTURES; MOLDING REPLICATIONS; POTENTIAL SOLUTIONS; SOLID-STATE BONDINGS; TECHNICAL FEASIBILITIES;

HEAT EXCHANGERS;

EID: 61849127340     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/3/035009     Document Type: Article

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