Growth and selection of intermetallic species in Sn-Ag-Cu No-Pb solder systems based on pad metallurgies and thermal histories

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1215-1221

  Lehman, L P ^a   Kinyanjui, R K ^a   Zavalij, L ^a   Zribi, A ^a   Cotts, E J ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; HIGH TEMPERATURE EFFECTS; INTERFACES (MATERIALS); INTERMETALLICS; MELTING; NUCLEATION; SEMICONDUCTOR GROWTH; SOLDERED JOINTS; SOLUBILITY;

LEAD FREE SOLDERS; PAD INTERFACES; SILVER TIN PLATES; SOLDER MELT;

ELECTRONICS PACKAGING;

EID: 0038688846     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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2. K. N. Tu and K. Zeng, "Reliability Issues of Pb-Free solder Joints in Electronic Packaging Technology" 2002 Electronic Components and Technology Conference, Seattle, WA.
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10. "The Kinetics of Formation of Ternary Intermetallic Alloys in Pb-Sn and Cu-Ag-Sn Pb-free Electronic Joints," A. Zribi, L. Zavalij, P. Borgesen, A. Primavera, G. Westby, and E. J. Cotts, IEEE 2001 Electronic Components and Technology Conference, pp. 687 (2001).
11. "The Growth Rate of Dendrite in Super Cooled Tin," A. Rosenberg and W.C. Winegard, Acta Metallurgica, Vol. 2 (1954), pp 342-343