Electrochemical nucleation and growth of copper deposition onto FTO and n-Si(1 0 0) electrodes

Materials Chemistry and Physics

Volumn 115, Issue 1, 2009, Pages 385-390

  Khelladi, M R ^a   Mentar, L ^a   Azizi, A ^a   Sahari, A ^a   Kahoul, A ^a  

^a FERHAT ABBAS UNIVERSITY   (Algeria)

Author keywords

Chronoamperometry; Copper; Electrodeposition; Instantaneous; Nucleation

Indexed keywords

CHRONOAMPEROMETRY; COPPER; ELECTROCHEMICAL ELECTRODES; ELECTRODEPOSITION; NUCLEATION; SILICON; THREE DIMENSIONAL; TIN; TITANIUM COMPOUNDS;

ACTIVE SITES; COATED GLASS; COPPER DEPOSITIONS; CURRENT TRANSIENTS; DIFFUSION COEFFICIENTS; DIFFUSION LIMITEDS; ELECTROCHEMICAL NUCLEATIONS; INITIAL STAGES; INSTANTANEOUS; NUMBER DENSITIES; SI(1 0 0 ); SULFATE SOLUTIONS; THREE-DIMENSIONAL (3D);

CYCLIC VOLTAMMETRY;

EID: 61449249017     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2008.12.017     Document Type: Article

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