The effect of Ni catalytic nanoparticle on the growth of carbon nanotubes: A perspective from nanotribological characterization

Diamond and Related Materials

Volumn 18, Issue 2-3, 2009, Pages 528-532

  Jeng, Yeau Ren ^a   Wen, Hua Chiang ^a   Tsai, Ping Chi ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Carbon nanotubes; Coefficients of friction; Nanoparticles; Nanoscratch

Indexed keywords

ATOMIC FORCE MICROSCOPY; CATALYSIS; DIAMOND FILMS; ELECTRON MICROSCOPY; FORMING; FRICTION; GROWTH (MATERIALS); HIGH RESOLUTION ELECTRON MICROSCOPY; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; METAL FORMING; METAL MELTING; MICROWAVES; NANOCOMPOSITES; NANOPARTICLES; NANOTRIBOLOGY; NANOTUBES; NICKEL; PLASMA APPLICATIONS; PLASMA DEPOSITION; PLASMAS; SCANNING ELECTRON MICROSCOPY; SMELTING; SUBSTRATES; SURFACE STRUCTURE; SURFACE TOPOGRAPHY; SURFACE TREATMENT; TRIBOLOGY; VAPOR DEPOSITION;

CATALYST NANOPARTICLES; CATALYTIC NANOPARTICLES; CO-EFFICIENT OF FRICTIONS; COEFFICIENTS OF FRICTION; EFFECT OF CATALYSTS; EX-SITU ATOMIC FORCE MICROSCOPIES; HIGH-RESOLUTION TRANSMISSION ELECTRON MICROSCOPIES; HIGHER TEMPERATURES; METAL PARTICLES; MICROWAVE PLASMA CHEMICAL VAPOR DEPOSITION SYSTEMS; NANOSCRATCH; NANOTRIBOLOGICAL CHARACTERIZATIONS; NI NANOPARTICLES; PLASMA TREATMENTS; PRE TREATMENTS; PRE-TREATMENT TEMPERATURES; SCANNING ELECTRONS; SEM; SHEAR RESISTANCES; SUBSTRATE SURFACES; TRIBOLOGICAL BEHAVIORS; UNIFORM SIZES; WEAR DEPTHS; WELL-ALIGNED;

CARBON NANOTUBES;

EID: 59649113412     PISSN: 09259635     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.diamond.2008.09.019     Document Type: Article

References (37)

1. Iijima S. Nature 354 (1991) 56
2. Iijima S., and Ichihashi T. Nature 363 (1993) 603
3. Ajayan P.M., and Ebbesen T.W. Rep. Prog. Phys. 60 (1997) 1025
4. Wang Z.L., Poncharal P., and de Heer W.A. J. Phys. Chem. Solids 61 (2000) 1025
5. Sishen X., Wenzhi L., Zhengwei P., Baohe C., and Lianfeng S. J. Phys. Chem. Solids 61 (2000) 1153
6. Journet C., Maser W.K., Bernier P., Loiseau A., delaChapelle M.L., Lefrant S., Deniard P., Lee R., and Fischer J.E. Nature 388 (1997) 756
7. Thess A., Lee R., Nikolaev P., Dai H., Petit P., Robert J., Xu C., Lee Y.H., Kim S.G., Rinzler A.G., Colbert D.T., Scuseria G.E., Tomanek D., Fisher J.E., and Smalley R.E. Science 273 (1996) 483
8. Fan S., Chapline M.G., Franklin N.R., Tombler T.W., Cassell A.M., and Dai H. Science 283 (1999) 512
9. Ren Z.F., Huang Z.P., Xu J.W., Wang J.H., Bush P., Siegal M.P., and Provencio P.N. Science 282 (1998) 1105
10. Huh Y., Green M.L.H., Kim Y.H., Lee J.Y., and Lee C.J. Appl. Surf. Sci. 249 (2005) 145
11. Choi J.H., Lee T.Y., Choi S.H., Han J.H., Yoo J.B., Park C.Y., Jung T., Yu S.G., Yi W., Han I.T., and Kim J.M. Diamond Relat. Mater. 12 (2003) 794
12. Wang S., Wang P., and Zhou O. Diamond Relat. Mater. 15 (2006) 361
13. Han J.H., Choi S.H., Lee T.Y., Yoo J.B., Park C.Y., Jung T., Yi S.G.Y.W., Han I.T., and Kim J.M. Diamond Relat. Mater. 12 (2003) 878
14. Wang W.P., Wen H.C., Jian S.R., Juang J.Y., Lai Y.S., Tsai C.H., Wu W.F., Chen K.T., and Chou C.P. Appl. Surf. Sci. 253 (2007) 9248
15. Wen H.C., Yang K., Ou K.L., Wu W.F., Luo R.C., and Chou C.P. Microelectron. Eng. 82 (2005) 221
16. Rabe R., Breguet J.M., Schwaller P., Stauss S., Haug F.J., Patscheider J., and Michler J. Thin Solid Films 206 (2004) 469
17. Ni H., Li X., Gao H., and Nguyen T.P. Nanotechnology 16 (2005) 1746
18. Curry M., Li X., Huang F., Weaver M.L., and Street S.C. Tribol. Lett. 25 (2007) 133
19. Li X., Huang F., Curry M., Street S.C., and Weaver M.L. Tribol. Lett. 19 (2005) 273
20. Labdi S., Jellad A., and Maciejak O. Surf. Coat. Technol. 201 (2006) 113
21. Raichman Y., Kazakevich M., Rabkin E., and Tsur Y. Adv. Mater. 18 (2006) 2028
22. Baker R.T.K. Carbon 27 (1989) 315
23. Jian S.R., Chen Y.T., Wang C.F., Wen H.C., Chiu W.M., and Yang C.S. Nanoscale Res. Lett. 3 (2008) 230
24. Israelachvili J. Intermolecular & Surface Forces (1985), Academic Press, London Ch. 15
25. Almqvist N. Surf. Sci. 355 (1996) 221
26. Ruan J., and Bhushan B. ASME J. Tribol. 116 (1994) 378
27. Ruan J., and Bhushan B. J. Appl. Phys. 76 (1994) 8117
28. Sekler J., Steinmann P.A., and Hintermann H.E. Surf. Coat. Technol. 36 (1988) 519
29. Berg G., Friedrich C., Broszeit E., and Berger C. Fresenius J. Anal. Chem. 358 (1997) 281
30. Steinmann P.A., and Hintermann H.E. J. Vac. Sci. Technol. A7 (1989) 2267
31. Bhushan B., Gupta B.K., and Azarian M. Wear 181 (1995) 743
32. Xu F.T., Ye P.P., Curry M., Barnard J.A., and Street S.C. Tribol. Lett. 12 (2002) 189
33. Li X., Huang F., Curry M., Street S.C., and Weaver M.L. Thin Solid Films 473 (2005) 164
34. Kendall K. Ceram. Trans., 26 (1998) 125
35. Raichman Y., Kazakevich M., Rabkin E., and Tsur Y. Adv. Mater., 18 (2006) 2028
36. Grunthaner P.J., Gruthaner F.J., Scott D.M., Nicolet M.A., and Wayer J.M. J. Vac. Sci. Technol. 19 (1981) 641
37. Wang Y.H., Lin J., Huan C.H.A., and Chen G.S. Appl. Phys. Lett. 79 (2001) 680