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Volumn 15, Issue 1, 2005, Pages 130-135

Scum-free patterning of SU-8 resist for electroforming applications

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ELECTROPLATING; LITHOGRAPHY; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; NICKEL; REACTIVE ION ETCHING; SCANNING ELECTRON MICROSCOPY; ULTRAVIOLET RADIATION;

EID: 12344302063     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/1/020     Document Type: Article
Times cited : (13)

References (18)
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  • 2
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  • 4
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  • 5
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    • Optimization and characterization of ultrathick photoresist films
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    • Flack, W.1    Fan, W.2    White, S.3
  • 6
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    • Economic fabrication of microscale feature in thick resist using scanning projection lithography
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  • 8
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    • Orthogonal method for processing of SU-8 resist in UV-LIGA
    • Jingquan L, Jun Z, Guipu D, Xiaolin Z and Bingchu C 2001 Orthogonal method for processing of SU-8 resist in UV-LIGA Proc. SPIE 4557 462-6
    • (2001) Proc. SPIE , vol.4557 , pp. 462-466
    • Jingquan, L.1    Jun, Z.2    Guipu, D.3    Xiaolin, Z.4    Bingchu, C.5
  • 10
    • 0034545714 scopus 로고    scopus 로고
    • High aspect ratio microstructure fabrication using SU-8 resist
    • Jun Z, Xiaolin Z and Zhiping N 2000 High aspect ratio microstructure fabrication using SU-8 resist Proc. SPIE 4147 86-9
    • (2000) Proc. SPIE , vol.4147 , pp. 86-89
    • Jun, Z.1    Xiaolin, Z.2    Zhiping, N.3
  • 11
    • 0034768959 scopus 로고    scopus 로고
    • Study of spin coating properties of SU-8 thick-layer photoresist
    • Chen R H and Cheng C M 2001 Study of spin coating properties of SU-8 thick-layer photoresist Proc. SPIE 4345 494-501
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    • Chen, R.H.1    Cheng, C.M.2
  • 12
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  • 13
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.